Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25CEC
Rev. 10, 07/2013
i.MX25 Applications
Processor for
Consumer and
Industrial Products
Silicon Version 1.2
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
1
Introduction
Ordering Information
See
Table 1 on page 3
for ordering information.
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM® 926EJ-S™ core, with speeds of up to
400 MHz. The i.MX25 includes support for up to
133 MHz DDR2 memory, integrated 10/100
Ethernet MAC, and two on-chip USB PHYs. The
device is suitable for a wide range of applications,
including the following:
• Graphical remote controls
• Human Machine Interface (HMI)
• Residential and commercial control panels
• Residential gateway (smart metering)
• Handheld scanners and printers
• Electronic point-of-sale terminals
• Patient-monitoring devices
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139
4.7. Signal Contact Assignments—12 x 12 mm, 0.5 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
© 2009-2013 Freescale Semiconductor, Inc. All rights reserved.
Features of the i.MX25 processor include the following:
• Advanced power management—The heart of the device is a level of power management
throughout the IC that enables the multimedia features and peripherals to achieve minimum system
power consumption in active and various low-power modes. Power management techniques allow
the designer to deliver a feature-rich product that requires levels of power far lower than typical
industry expectations.
• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a
16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with
alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen
controller), and a programmable Smart DMA (SDMA) controller.
• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for
eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows
the designer to enable an ultra low power LCD refresh.
• Interface flexibility—The device interface supports connection to all common types of external
memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,
and managed NAND.
• Increased security—Because the need for advanced security for tethered and untethered devices
continues to increase, the i.MX25 processor delivers hardware-enabled security features that
enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust
tamper detection, secure boot, and secure software downloads.
• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.
• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.
• i.MX25 only supports Little Endian mode.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
2
Freescale Semiconductor
1.1
Ordering Information
Table 1. Ordering Information
Table 1
provides ordering information for the i.MX25.
Description
i.MX253
i.MX257
i.MX253
i.MX257
i.MX258
i.MX253
i.MX257
i.MX253
i.MX257
i.MX258
i.MX253
i.MX257
i.MX257
i.MX253
i.MX257
i.MX258
i.MX257
Part Number
MCIMX253DVM4
MCIMX257DVM4
MCIMX253CVM4
MCIMX257CVM4
MCIMX258CVM4
MCIMX253DJM4
MCIMX257DJM4
MCIMX253CJM4
MCIMX257CJM4
MCIMX258CJM4
MCIMX253DJM4A
MCIMX257DJM4A
MCIMX257DJM4AR2
MCIMX253CJM4A
MCIMX257CJM4A
MCIMX258CJM4A
MCIMX257CJN4A
Silicon
Version
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.2
1.2
1.2
1.2
1.2
1.2
1.2
Projected
Temperature
Range (°C)
–20 to +70
–20 to +70
–40 to +85
–40 to +85
–40 to +85
–20 to +70
–20 to +70
–40 to +85
–40 to +85
–40 to +85
–20 to +70
–20 to +70
–20 to +70
–40 to +85
–40 to +85
–40 to +85
–40 to +85
Package
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
12 x 12mm, 0.5mm pitch,
MAPBGA-347
Ballmap
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 107
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
Freescale Semiconductor
3
Table 2
shows the functional differences between the different parts in the i.MX25 family.
Table 2. i.MX25 Parts Functional Differences
Features
Core
CPU Speed
L1 I/D Cache
On-chip SRAM
PATA/CE-ATA
LCD Controller
Touchscreen
CSI
FlexCAN (2)
ESAI
SIM (2)
Security
10/100 Ethernet
HS USB 2.0 OTG + PHY
HS USB 2.0 Host + PHY
12-bit ADC
SD/SDIO/MMC (2)
External Memory Controller
I
2
C (3)
SSI/I2S (2)
CSPI (2)
UART (5)
MCIMX253
ARM 926EJ-S
400 MHz
16K I/D
128 KB
Yes
Yes
—
—
—
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX257
ARM 926EJ-S
400 MHz
16K I/D
128 KB
Yes
Yes
Yes
Yes
Yes
Yes
Yes
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX258
ARM 926EJ-S
400 MHz
16K I/D
128 KB
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
4
Freescale Semiconductor
1.2
Block Diagram
NOR
Flash/
PSRAM
Figure 1
shows the simplified interface block diagram.
DDR2 /
MDDR
NAND
Flash
Ext. Graphics
Accelerator
Camera
Sensor
LCD Display 1
ARM Processor Domain (AP)
External Memory
Interface (EMI)
CSI
LCDC /
SLCDC
Smart
DMA
ARM9
Platform
ARM926EJ-S
L1 I/D cache
ARM Peripherals
SSI
AUDMUX
I
2
C(3)
HS USB OTG
HS USB OTG PHY
Shared
Domain
SPBA
HS USB Host
FS USB Host PHY
SDMA Peripherals
AVIC
MAX
AIPS(2)
ETM
UART(2)
CSPI
eSDHC(2)
FlexCAN(2)
ECT
ECT
IOMUX
IIM
RTICv3
RNGB
SCC
DRYICE
KPP
PWM(4)
Timers
RTC
WDOG
GPT(4)
GPIO(3)
EPIT(2)
SSI(1)
ESAI
UART(3)
CSPI(2)
ADC/TSC
SIM(2)
ATA
FEC
Internal
Memory
Fusebox
1-WIRE
Audio/Power
Management
JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypad
Access.
Conn.
Figure 1. i.MX25 Simplified Interface Block Diagram
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
Freescale Semiconductor
5
Wireless Connectivity
京公网安备 11010802033920号
EEWORLD
