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MCIMX253DVM4

Description
IC MPU I.MX25 400MHZ 400MAPBGA
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,153 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MCIMX253DVM4 Overview

IC MPU I.MX25 400MHZ 400MAPBGA

MCIMX253DVM4 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instructionLFBGA, BGA400,20X20,32
Contacts400
Reach Compliance Codeunknown
ECCN code5A002
Other featuresALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US
Address bus width26
bit size32
boundary scanYES
Bus compatibilityI2C; USB
maximum clock frequency24 MHz
External data bus width16
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B400
length17 mm
low power modeYES
Humidity sensitivity level3
Number of I/O lines6
Number of terminals400
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA400,20X20,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1.2/1.5,1.8/3.3 V
Certification statusNot Qualified
RAM (number of words)65536
Maximum seat height1.6 mm
speed400 MHz
Maximum supply voltage1.52 V
Minimum supply voltage1.38 V
Nominal supply voltage1.45 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper - with Nickel barrier
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width17 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25CEC
Rev. 10, 07/2013
i.MX25 Applications
Processor for
Consumer and
Industrial Products
Silicon Version 1.2
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
1
Introduction
Ordering Information
See
Table 1 on page 3
for ordering information.
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM® 926EJ-S™ core, with speeds of up to
400 MHz. The i.MX25 includes support for up to
133 MHz DDR2 memory, integrated 10/100
Ethernet MAC, and two on-chip USB PHYs. The
device is suitable for a wide range of applications,
including the following:
• Graphical remote controls
• Human Machine Interface (HMI)
• Residential and commercial control panels
• Residential gateway (smart metering)
• Handheld scanners and printers
• Electronic point-of-sale terminals
• Patient-monitoring devices
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139
4.7. Signal Contact Assignments—12 x 12 mm, 0.5 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
© 2009-2013 Freescale Semiconductor, Inc. All rights reserved.

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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