LPC1817JET100,551 datasheet, PDF

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LPC1817JET100,551: DescriptionRISC Microcontroller, 32-Bit, FLASH, CMOS, PBGA100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，155 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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LPC1817JET100,551 Overview

RISC Microcontroller, 32-Bit, FLASH, CMOS, PBGA100

LPC1817JET100,551 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	TFBGA-100
Reach Compliance Code	unknown
Has ADC	YES
Address bus width	14
bit size	32
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	YES
External data bus width	8
JESD-30 code	S-PBGA-B100
length	9 mm
Number of I/O lines	49
Number of terminals	100
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	180 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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LPC185x/3x/2x/1x

32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB

SRAM; Ethernet, two High-speed USB, LCD, EMC

Rev. 5.2 — 8 March 2016

Product data sheet

1. General description

The LPC185x/3x/2x/1x are ARM Cortex-M3 based microcontrollers for embedded

applications. The ARM Cortex-M3 is a next generation core that offers system

enhancements such as low power consumption, enhanced debug features, and a high

level of support block integration.

The LPC185x/3x/2x/1x operate at CPU frequencies of up to 180 MHz. The ARM

Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with

separate local instruction and data buses as well as a third bus for peripherals. The ARM

Cortex-M3 CPU also includes an internal prefetch unit that supports speculative

branching.

The LPC185x/3x/2x/1x include up to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB of

EEPROM memory, a quad SPI Flash Interface (SPIFI), a State-configurable Timer/PWM

(SCTimer/PWM) subsystem, two High-speed USB controllers, Ethernet, LCD, an external

memory controller, and multiple digital and analog peripherals.

For additional documentation related to the LPC18xx parts, see

Section 17 “References”.

2. Features and benefits



Processor core



ARM Cortex-M3 processor (version r2p1), running at CPU frequencies of up to

180 MHz.



ARM Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions.



ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).



Non-maskable Interrupt (NMI) input.



JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points.



Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.



System tick timer.



On-chip memory



Up to 1 MB on-chip dual bank flash memory with flash accelerator.



16 kB on-chip EEPROM data memory.



136 kB SRAM for code and data use.



Multiple SRAM blocks with separate bus access.



64 kB ROM containing boot code and on-chip software drivers.



64 bit+ 256 bit of One-Time Programmable (OTP) memory for general-purpose

use.



Clock generation unit

LPC1817JET100,551 Related Products

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Description	RISC Microcontroller, 32-Bit, FLASH, CMOS, PBGA100	RISC Microcontroller	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	Array/Network Resistor, Bussed, Thin Film, 0.1W, 264ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 3206,
package instruction	TFBGA-100	,	LBGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	BGA, BGA256,16X16,40	SMT, 3206
Reach Compliance Code	unknown	unknown	compliant	compliant	compliant	compliant	compliant	compliant
Has ADC	YES	-	YES	YES	YES	YES	YES	-
bit size	32	-	32	32	32	32	32	-
maximum clock frequency	25 MHz	-	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	-
DMA channel	YES	-	YES	YES	YES	YES	YES	-
JESD-30 code	S-PBGA-B100	-	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	-
length	9 mm	-	17 mm	17 mm	17 mm	17 mm	17 mm	-
Number of I/O lines	49	-	164	164	164	164	164	-
Number of terminals	100	-	256	256	256	256	256	16
PWM channel	NO	-	YES	YES	YES	YES	YES	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TFBGA	-	LBGA	BGA	BGA	LBGA	BGA	-
Package shape	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY	SMT
ROM programmability	FLASH	-	FLASH	FLASH	FLASH	FLASH	FLASH	-
speed	180 MHz	-	180 MHz	180 MHz	180 MHz	180 MHz	180 MHz	-
Maximum supply voltage	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage	3 V	-	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	-
Nominal supply voltage	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-
surface mount	YES	-	YES	YES	YES	YES	YES	-
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	THIN FILM
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL	-
Terminal pitch	0.8 mm	-	1 mm	1 mm	1 mm	1 mm	1 mm	-
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-
width	9 mm	-	17 mm	17 mm	17 mm	17 mm	17 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-
Base Number Matches	-	1	1	1	1	1	1	-
Brand Name	-	-	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-
Is it Rohs certified?	-	-	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	-	-	BGA	BGA	BGA	BGA	BGA	-
Contacts	-	-	256	256	256	256	256	-
Manufacturer packaging code	-	-	SOT740-2	SOT740-2	SOT740-2	SOT740-2	SOT740-2	-
CPU series	-	-	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3	-
JESD-609 code	-	-	e1	e1	e1	e1	e8	e4
Humidity sensitivity level	-	-	3	3	3	3	3	-
Maximum operating temperature	-	-	85 °C	105 °C	105 °C	85 °C	85 °C	155 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Encapsulate equivalent code	-	-	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	-
power supply	-	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
RAM (bytes)	-	-	139264	139264	139264	139264	139264	-
rom(word)	-	-	524288	1048576	1048576	1048576	1048576	-
Temperature level	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)	Gold (Au) - with Nickel (Ni) barrier

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