EDO DRAM, 512KX8, 40ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | SOJ |
| package instruction | SOJ, SOJ28,.44 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 40 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-J28 |
| JESD-609 code | e0 |
| length | 18.42 mm |
| memory density | 4194304 bit |
| Memory IC Type | EDO DRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 28 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOJ |
| Encapsulate equivalent code | SOJ28,.44 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum seat height | 3.76 mm |
| self refresh | NO |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.14 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| KM48C514DJ-4 | KM48C514DT-L4 | KM48C514DT-4 | KM48C514DJ-L4 | |
|---|---|---|---|---|
| Description | EDO DRAM, 512KX8, 40ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | EDO DRAM, 512KX8, 40ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | EDO DRAM, 512KX8, 40ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | EDO DRAM, 512KX8, 40ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOJ | TSOP | TSOP | SOJ |
| package instruction | SOJ, SOJ28,.44 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 40 ns | 40 ns | 40 ns | 40 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 18.42 mm | 18.41 mm | 18.41 mm | 18.42 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOJ | TSOP2 | TSOP2 | SOJ |
| Encapsulate equivalent code | SOJ28,.44 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 | 1024 | 1024 |
| Maximum seat height | 3.76 mm | 1.2 mm | 1.2 mm | 3.76 mm |
| self refresh | NO | YES | NO | YES |
| Maximum standby current | 0.001 A | 0.00015 A | 0.001 A | 0.00015 A |
| Maximum slew rate | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | GULL WING | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
| Maker | SAMSUNG | - | SAMSUNG | SAMSUNG |