EDO DRAM Module, 4MX64, 70ns, CMOS, PDMA168, DIMM-168
| Parameter Name | Attribute value |
| Maker | SK Hynix |
| Parts packaging code | DIMM |
| package instruction | , |
| Contacts | 168 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 70 ns |
| Other features | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH |
| JESD-30 code | R-PDMA-N168 |
| memory density | 268435456 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 64 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 168 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX64 |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | DUAL |
| HYM5V64404CKG-70 | HYM5V64404CTKG-80 | HYM5V64404CKG-80 | HYM5V64404CTKG-70 | |
|---|---|---|---|---|
| Description | EDO DRAM Module, 4MX64, 70ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 4MX64, 80ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 4MX64, 80ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 4MX64, 70ns, CMOS, PDMA168, DIMM-168 |
| Maker | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Parts packaging code | DIMM | DIMM | DIMM | DIMM |
| Contacts | 168 | 168 | 168 | 168 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 70 ns | 80 ns | 80 ns | 70 ns |
| Other features | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH |
| JESD-30 code | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 |
| memory density | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bi |
| Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 64 | 64 | 64 | 64 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 168 | 168 | 168 | 168 |
| word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 | 4000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4MX64 | 4MX64 | 4MX64 | 4MX64 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| self refresh | YES | YES | YES | YES |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
京公网安备 11010802033920号
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