IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | ZIP |
| package instruction | ZIP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | STATIC COLUMN |
| Maximum access time | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-PZIP-T19 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STATIC COLUMN DRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 19 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | ZIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 10.16 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |

| TC514268AZ-70 | TC514268AJ-70 | TC514268AJ-80 | TC514268AP-80 | TC514268AP-10 | TC514268AZ-10 | TC514268AJ-10 | TC514268AP-70 | TC514268AZ-80 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM | IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | ZIP | SOJ | SOJ | DIP | DIP | ZIP | SOJ | DIP | ZIP |
| package instruction | ZIP, | SOJ, | SOJ, | DIP, | DIP, | ZIP, | SOJ, | DIP, | ZIP, |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN |
| Maximum access time | 70 ns | 70 ns | 80 ns | 80 ns | 100 ns | 100 ns | 100 ns | 70 ns | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-PZIP-T19 | R-PDSO-J20 | R-PDSO-J20 | R-PDIP-T20 | R-PDIP-T20 | R-PZIP-T19 | R-PDSO-J20 | R-PDIP-T20 | R-PZIP-T19 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
| Memory IC Type | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 19 | 20 | 20 | 20 | 20 | 19 | 20 | 20 | 19 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | ZIP | SOJ | SOJ | DIP | DIP | ZIP | SOJ | DIP | ZIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 10.16 mm | 3.55 mm | 3.55 mm | 5 mm | 5 mm | 10.16 mm | 3.55 mm | 5 mm | 10.16 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | Toshiba Semiconductor | - | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| width | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | 7.62 mm | 7.62 mm | - |