TC514268AP-70 datasheet, PDF - EEWORLD Datasheet

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TC514268AP-70: DescriptionIC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM; Categorystorage storage; File Size855KB，20 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC514268AP-70 Overview

IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM

TC514268AP-70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	20
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	STATIC COLUMN
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
memory density	1048576 bi
Memory IC Type	STATIC COLUMN DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	20
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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TC514268AP-70 Related Products

	TC514268AP-70	TC514268AJ-70	TC514268AJ-80	TC514268AP-80	TC514268AP-10	TC514268AZ-10	TC514268AJ-10	TC514268AZ-70	TC514268AZ-80
Description	IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PDIP20, PLASTIC, DIP-20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 100 ns, PDSO20, PLASTIC, SOJ-26/20, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 70 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM	IC 256K X 4 STATIC COLUMN DRAM, 80 ns, PZIP19, PLASTIC, ZIP-20/19, Dynamic RAM
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOJ	SOJ	DIP	DIP	ZIP	SOJ	ZIP	ZIP
package instruction	DIP,	SOJ,	SOJ,	DIP,	DIP,	ZIP,	SOJ,	ZIP,	ZIP,
Contacts	20	20	20	20	20	20	20	20	20
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN
Maximum access time	70 ns	70 ns	80 ns	80 ns	100 ns	100 ns	100 ns	70 ns	80 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDIP-T20	R-PDSO-J20	R-PDSO-J20	R-PDIP-T20	R-PDIP-T20	R-PZIP-T19	R-PDSO-J20	R-PZIP-T19	R-PZIP-T19
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	1048576 bi	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM
memory width	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	19	20	19	19
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	SOJ	DIP	DIP	ZIP	SOJ	ZIP	ZIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5 mm	3.55 mm	3.55 mm	5 mm	5 mm	10.16 mm	3.55 mm	10.16 mm	10.16 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG	DUAL	ZIG-ZAG	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	Toshiba Semiconductor	-	-	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	-	7.62 mm	-	-

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