CX2SM AT CRYSTAL
9.6 MHz to 250 MHz
™
Low Profile, Miniature Surface Mount AT Quartz Crystal
Fundamental Mode:
Third Overtone:
9.6 MHz - 250 MHz
48 MHz - 160 MHz
DESCRIPTION
actual size
STATEK’s miniature CX2SM AT crystals in leadless
ceramic packages are designed for surface mounting on
printed circuit boards or hybrid substrates. These crystals
are low profile and have a small footprint. The CX2SM
crystal is manufactured using the STATEK-developed
photolithographic process, and was designed utilizing the
experience acquired by producing millions of crystals for
industrial, commercial, military and medical applications.
FEATURES
glass lid
X
XXX
S
ceramic lid
side view
PACKAGE DIMENSIONS
B
1
2
I
G
3
F
H
A
Designed for surface mount applications using infrared,
vapor phase, or epoxy mount techniques.
Hermetically sealed ceramic package
Excellent aging characteristics
Available with glass or ceramic lid
High shock and vibration resistance
Custom designs available
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
C
D
E
TYPICAL
DIM
A
B
C
D
E
F
G
H
I
inches
0.260
0.094
-
0.035
0.059
0.050
0.105
0.155
0.210
mm
6.60
2.39
-
0.89
1.50
1.27
2.67
3.94
5.33
MAXIMUM
inches
0.275
0.108
0.045
0.069
0.060
0.115
0.165
0.220
mm
6.99
2.74
1.14
1.75
1.52
2.92
4.19
5.59
Medical
Infusion Pumps
Industrial, Computer & Communications
Engine Control
Down-hole Data Recorder
Military & Aerospace
Communications
Smart Munitions
Timing Devices (Fuzes)
Surveillance Devices
see below
THICKNESS (DIM C) MAXIMUM
GLASS LID
inches
SM1
SM2/SM4
SM3/SM5
0.065
0.067
0.070
mm
1.65
1.70
1.78
CERAMIC LID
inches
0.075
0.077
0.080
mm
1.91
1.96
2.03
Note: Terminal 1 is electrically connected internally to terminal 3
10136 - Rev B
S
YS
ERT
T
E
M
C
IFIC
T
A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
01
Pb
N
IO
IS
O
90
SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25
O
C unless otherwise noted.
Specifications are subject to change without notice.
Fundamental Frequency
Motional Resistance (R
1
)
Motional Capacitance C
1
(fF)
Quality Factor Q (k)
Shunt Capacitance C
0
(pF)
Calibration Tolerance
1
Load Capacitance
2
Drive Level
Frequency-Temperature
Stability
1,3
+
_
10 MHz
60
2.8
95
1.4
32 MHz 155.52 MHz
25
6.2
30
2.3
10
4.0
30
2.3
Designation
SM1
SM2
SM3
SM4
SM5
Termination
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Max Process Temperature 260
O
C for 20 sec.
PACKAGING OPTIONS
100 ppm, or tighter as required
• Tray Pack
• 16mm tape, 7” or 13” reels
Per EIA 481
(see Tape and Reel data sheet 10109)
SUGGESTED LAND PATTERN
20 pF for f
≤
50 MHz
10 pF for f > 50 MHz
500
µW
MAX for f
≤
50 MHz
200
µW
MAX for f > 50 MHz
+
_
+
_
+
_
50 ppm to
100 ppm to
+
_
+
_
10 ppm (Commercial)
20 ppm (Industrial)
0.070 (1.78)
Aging, first year
4
Shock, survival
5
Vibration, survival
6
Operating Temp. Range
_
100 ppm to
+
30 ppm (Military)
5 ppm MAX
(better than 1 ppm available)
3,000 g, 0.3 ms,
1
/
2
sine
20 g, 10-2,000 Hz swept sine
-10
O
C to +70
O
C (Commercial)
-40
O
C to +85
O
C (Industrial)
-55
O
C to +125
O
C (Military)
-55
O
C to +125
O
C
260
O
C for 20 sec.
EQUIVALENT CIRCUIT
0.114
(2.90)
Storage Temp. Range
Max Process Temperature
0.105 (2.67)
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies
contact factory.
5. Higher shock version available.
6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
C
0
1
L
1
C
1
R
1
2
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
HOW TO ORDER CX2SM AT CRYSTALS
CX2
“S” if special or
custom design.
Blank if Std.
S
O.T. = 3
RD
O.T. Mode
Blank = Fundamental
Mode
C
C = Ceramic Lid
Blank = Glass Lid
SM1
–
32.0M
Frequency
M = MHz
,
100
Calibration
Tolerance
@ 25
O
C
(in ppm)
/
100
Frequency
Stability over
Temp. Range
(in ppm)
/
—
/
I
Operating Temp. Range:
C = -10
O
C to +70
O
C
I
= -40
O
C to +85
O
C
M = -55
O
C to +125
O
C
S = Customer Specified
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
OR
—
/
—
/
200
Total
Frequency
Tolerance
(in ppm)
/
I
Operating Temp. Range:
C = -10
O
C to +70
O
C
I
= -40
O
C to +85
O
C
M = -55
O
C to +125
O
C
S = Customer Specified
10136 - Rev B
S
YS
ERT
T
E
M
C
IFIC
T
A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
01
Pb
N
IO
IS
O
90
京公网安备 11010802033920号
EEWORLD
