CX4SM AT CRYSTAL
14 MHz to 250 MHz
™
Ultra-Miniature, Low Profile
Surface Mount AT Quartz Crystal
DESCRIPTION
STATEK’s ultra-miniature CX4SM AT crystals in leadless
ceramic packages are designed for surface mounting on
printed circuit boards or hybrid substrates. These crystals
are low profile and have a very small land pattern.
FEATURES
actual size
glass lid
XXX
SX
ceramic lid
side view
PACKAGE DIMENSIONS
Designed for surface mount applications using
infrared, vapor phase, wave solder or epoxy mount
techniques.
Low profile (less than 1.2 mm) hermetically sealed
ceramic package
Excellent aging characteristics
Available with glass or ceramic lid
High shock and vibration resistance
Custom designs available
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
D
A
TOP
F
BOTTOM
B
TYPICAL
DIM
A
B
C
D
E
F
inches
0.197
0.072
-
0.036
0.020
0.025
C
mm
5.00
1.83
-
0.91
0.51
0.64
D
E
MAXIMUM
inches
0.210
0.085
mm
5.33
2.16
Medical
Neurostimulators
Cochlear Implants
Implantable CRM
Infusion Pumps
Glucose Monitors
Industrial, Computer & Communications
Instrumentation
Process Control
Environmental Control
Engine Control
Handheld Inventory Control
Down-hole Data Recorder
Telemetry
Military & Aerospace
Communications Radio
Smart Munitions
Timing Devices (Fuzes)
Surveillance Devices
see below
0.046
-
-
1.16
-
-
THICKNESS (DIM C) MAXIMUM
GLASS LID
inches
SM1
SM2/SM4
SM3/SM5
0.045
0.046
0.048
mm
1.14
1.17
1.22
CERAMIC LID
inches
0.050
0.051
0.053
mm
1.27
1.30
1.35
10150 - Rev. D
S
YS
ERT
T
E
M
C
IFIC
T
A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
01
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N
IO
IS
O
90
SPECIFICATIONS
Specifications are typical at 25
O
C unless otherwise noted. Specifications are subject to change without notice.
Fundamental Frequency 14.7456 MHz 16MHz 20 MHz 32 MHz 40 MHz 80 MHz 160 MHz 200 MHz
Motional Resistance R
1
(Ω)
Motional Capacitance C
1
(fF)
Quality Factor Q (k)
Shunt Capacitance C
0
(pF)
Calibration Tolerances
1
Load Capacitance
Drive Level
Frequency-Temperature
Stability
1,3
+
_
60
1.4
120
0.8
75
1.5
90
0.9
50
1.4
110
0.9
30
2.5
70
1.1
30
1.5
90
1.0
30
1.8
40
1.0
30
2.5
20
1.5
40
2.0
15
1.5
100 ppm, or tighter as required
10 pF
(unless specified otherwise)
200
µW
MAX for f
≤
50 MHz
TERMINATIONS
Designation
SM1
100
µW
MAX for f > 50 MHz
SM2
+
_
50 ppm to
+
10 ppm (Commercial) SM3
_
+
_
100 ppm to
+
20 ppm (Industrial)
_
SM4
+
SM5
_
100 ppm to
+
30 ppm (Military)
_
5 ppm MAX
(better than 1 ppm available)
Termination
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
260
O
C for 20 sec.
Aging, first year
3
Shock, survival
4
Vibration, survival
5
Max Process Temperature
5,000 g, 0.3 ms,
1
/
2
sine
20 g, 10-2,000 Hz swept sine
-10
O
C to +70
O
C (Commercial)
-40
O
C to +85
O
C (Industrial)
-55
O
C to +125
O
C (Military)
-55
O
C to +125
O
C
260
O
C for 20 sec.
EQUIVALENT CIRCUIT
Operating Temp. Range
C
0
1
L
1
C
1
R
1
2
Storage Temp. Range
Max Process Temperature
1) Other tolerances available. Contact factory.
2) Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
3) 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies
contact factory.
4) Higher shock version available.
5) Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
SUGGESTED LAND PATTERN
0.059 (1.5)
PACKAGING OPTIONS
0.092 (2.3)
• Tray Pack
• Tape and Reel
Per EIA 481
(see Tape and Reel data sheet 10109)
inches (mm)
0.160 (4.0)
HOW TO ORDER CX4SM AT CRYSTALS
CX4
S
C
C = Ceramic Lid
Blank = Glass Lid
SM1
–
32.0M
Frequency
M = MHz
,
100
Calibration
Tolerance
@25
O
C
(in ppm)
/
100
Frequency
Stability over
Temp. Range
/
—
/
I
Operating Temp. Range:
C = -10
O
C to +70
O
C
I
= -40
O
C to +85
O
C
M = -55
O
C to +125
O
C
S = Customer Specified
200
Total
Frequency
Tolerance
(in ppm)
/
I
Operating Temp. Range:
C = -10
O
C to +70
O
C
I
= -40
O
C to +85
O
C
M = -55
O
C to +125
O
C
S = Customer Specified
10150 - Rev. D
S
“S” if special or
custom design.
Blank if standard
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
OR
—
/
—
/
YS
ERT
T
E
M
C
IFIC
T
A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
01
Pb
N
IO
IS
O
90
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