M55342K05B208BPT1 datasheet, PDF

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M55342K05B208BPT1: DescriptionRESISTOR, THIN FILM, 0.225 W, 0.1 %, 100 ppm, 208000 ohm, SURFACE MOUNT, 2208, CHIP; CategoryPassive components The resistor; File Size111KB，4 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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M55342K05B208BPT1 Overview

RESISTOR, THIN FILM, 0.225 W, 0.1 %, 100 ppm, 208000 ohm, SURFACE MOUNT, 2208, CHIP

M55342K05B208BPT1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Vishay
package instruction	SMT, 2208
Reach Compliance Code	unknown
Other features	NON-INDUCTIIVE, LASER TRIMMABLE
structure	Rectangular
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.254 mm
Package length	5.842 mm
Package form	SMT
Package width	1.905 mm
method of packing	TR
Rated power dissipation(P)	0.225 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	208000 Ω
Resistor type	FIXED RESISTOR
size code	2208
surface mount	YES
technology	THIN FILM
Temperature Coefficient	100 ppm/°C
Terminal shape	WRAPAROUND
Tolerance	0.1%
Operating Voltage	175 V

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E/H (Military M/D55342)

Vishay Thin Film

QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips

FEATURES

•

Established reliability, “R” failure rate level (100 ppm), C = 2

•

High purity alumina substrate 99.6 % purity

•

Wraparound termination featuring a tenacious adhesion

layer covered with an electroplated nickel barrier layer for

+ 150 °C operating conditions

•

Very low noise and voltage coefficient

(< - 25 dB, 0.5 ppm/V)

•

Non-inductive

•

Laser-trimmed tolerances ± 0.1 %

•

Wraparound resistance less than 0.010

typical

•

In-lot tracking less than 5 ppm/°C

•

Complete MIL-testing available in-house

•

Antistatic waffle pack or tape and reel packaging available

•

Military/aerospace/QPL

SURFACE MOUNT

CHIPS

Actual Size

M55342/02

Thin Film Mil chip resistors feature all sputtered wraparound

termination for excellent adhesion and dimensional

uniformity. They are ideal in applications requiring stringent

performance requirements. Established reliability is assured

through 100 % screening and extensive environmental lot

testing. Wafer is sawed producing exact dimensions and

clean, straight edges.

Note

•

Specification changed

MIL-PRF-55342

DSCC

from

MIL-R-55342

CONSTRUCTION

TYPICAL PERFORMANCE

ABS

Passivation

Resistor film

Solder

coating

Nickel barrier

High ourity

alumina substrate

Adhesion layer

TCR

TOL

0.1

STANDARD ELECTRICAL SPECIFICATIONS

Test

Material

Absolute TCR

Absolute Tolerance

Stability:

ΔR

Absolute

Voltage Coefficient

Operating Temperature Range

Storage Temperature Range

Noise

Shelf Life Stability

SPECIFICATIONS

Passivated nichrome

± 25 ppm/°C to ± 300 ppm/°C TCR

± 0.1 %

± 0.5 ppm/V

- 55 °C to + 125 °C

- 55 °C to + 150 °C

- 25 dB

100 ppm

1 year at + 25 °C

- 55 °C to + 125 °C

+ 25 °C

2000 h at + 70 °C

CONDITIONS

www.vishay.com

For technical questions, contact:

thin-film@vishay.com

Document Number: 60018

Revision: 16-Sep-09

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