EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342M10B243ACTF

Description
RESISTOR, THIN FILM, 0.5 W, 0.1 %, 300 ppm, 243 ohm, SURFACE MOUNT, 1010, CHIP
CategoryPassive components    The resistor   
File Size111KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

M55342M10B243ACTF Overview

RESISTOR, THIN FILM, 0.5 W, 0.1 %, 300 ppm, 243 ohm, SURFACE MOUNT, 1010, CHIP

M55342M10B243ACTF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 1010
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresNON-INDUCTIVE, LASER TRIMMABLE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length2.667 mm
Package formSMT
Package width2.54 mm
method of packingTR, Embossed, 7 Inch
Rated power dissipation(P)0.5 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance243 Ω
Resistor typeFIXED RESISTOR
size code1010
surface mountYES
technologyTHIN FILM
Temperature Coefficient300 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage75 V
E/H (Military M/D55342)
Vishay Thin Film
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
FEATURES
Established reliability, “R” failure rate level (100 ppm), C = 2
High purity alumina substrate 99.6 % purity
Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+ 150 °C operating conditions
Very low noise and voltage coefficient
(< - 25 dB, 0.5 ppm/V)
Non-inductive
Laser-trimmed tolerances ± 0.1 %
Wraparound resistance less than 0.010
Ω
typical
In-lot tracking less than 5 ppm/°C
Complete MIL-testing available in-house
Antistatic waffle pack or tape and reel packaging available
Military/aerospace/QPL
SURFACE MOUNT
CHIPS
Actual Size
M55342/02
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing. Wafer is sawed producing exact dimensions and
clean, straight edges.
Note
Specification changed
MIL-PRF-55342
by
DSCC
from
MIL-R-55342
to
CONSTRUCTION
TYPICAL PERFORMANCE
ABS
Passivation
Resistor film
Solder
coating
Nickel barrier
High ourity
alumina substrate
Adhesion layer
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
Test
Material
Absolute TCR
Absolute Tolerance
Stability:
ΔR
Absolute
Voltage Coefficient
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability
SPECIFICATIONS
Passivated nichrome
± 25 ppm/°C to ± 300 ppm/°C TCR
± 0.1 %
± 0.1 %
± 0.5 ppm/V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
- 25 dB
100 ppm
1 year at + 25 °C
- 55 °C to + 125 °C
+ 25 °C
2000 h at + 70 °C
CONDITIONS
www.vishay.com
50
For technical questions, contact:
thin-film@vishay.com
Document Number: 60018
Revision: 16-Sep-09
About file-driven learning, urgent
I am going to develop a file driver recently. I have some experience in driver development (not much, but it is enough for beginners). I want to read a short program (preferably with comments) first, ...
ltiqc Embedded System
[RVB2601 Creative Application Development] 1. Unboxing
# Preface It has been a while since I got the board. After finishing my work, I started to learn about this board from Pingtou Ge. This is the first time I use a Pingtou Ge board and the first time I ...
hehung XuanTie RISC-V Activity Zone
How can I customize the English version of wince4.2 in Platform Builder 4.2?
How can I customize the English version of wince4.2 in Platform Builder 4.2? I turned off all the language options when customizing, but the customized wince4.2 still has a Chinese interface...
dangl Embedded System
Use FPGA to correctly capture LVDS data
[i=s]This post was last edited by 5525 on 2016-7-17 11:35[/i] The advantages of using LVDS to transmit data are not much to say. The application of using FPGA + LVDS to transmit IC is not difficult, s...
5525 FPGA/CPLD
S3C2440 Wince5.0 ActiveSync cannot synchronize
Using the same Eboot, the nk of ce4.2 on the development board can be synchronized, indicating that the hardware is fine [b] ce5.0 is configured as follows [/b] PB adds the following components end us...
lyzj3210 Embedded System
How to get the device serial number sn
extern "C" __declspec(dllimport) BOOL KernelIoControl( DWORD dwIoControlCode, LPVOID lpInBuf, DWORD nInBufSize, LPVOID lpOutBuf, DWORD nOutBufSize, LPDWORD lpBytesReturned ); #define IOCTL_HAL_GET_DEV...
flydragon83 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2531  485  2528  1922  907  51  10  39  19  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号