LM49120TL datasheet, PDF - EEWORLD Datasheet

LM49120TL: DescriptionAudio Sub-System with Mono Class AB Loudspeaker Amplifier and Stereo OCL/SE Headphone Amplifier; CategoryAnalog mixed-signal IC Consumption circuit; File Size553KB，28 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LM49120TL Overview

Audio Sub-System with Mono Class AB Loudspeaker Amplifier and Stereo OCL/SE Headphone Amplifier

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	MICRO, SMD-16
Reach Compliance Code	_compli
ECCN code	EAR99
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	R-PBGA-B16
JESD-609 code	e0
Humidity sensitivity level	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA16,4X4,20
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	3.3/5 V
Certification status	Not Qualified
Maximum slew rate	8 mA
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM

	LM49120TL	LM49120	LM49120TLX
Description	Audio Sub-System with Mono Class AB Loudspeaker Amplifier and Stereo OCL/SE Headphone Amplifier	Audio Sub-System with Mono Class AB Loudspeaker Amplifier and Stereo OCL/SE Headphone Amplifier	Audio Sub-System with Mono Class AB Loudspeaker Amplifier and Stereo OCL/SE Headphone Amplifier
Is it Rohs certified?	incompatible	-	incompatible
Maker	National Semiconductor（TI ）	-	National Semiconductor（TI ）
package instruction	MICRO, SMD-16	-	MICRO, SMD-16
Reach Compliance Code	_compli	-	_compli
ECCN code	EAR99	-	EAR99
Commercial integrated circuit types	AUDIO AMPLIFIER	-	AUDIO AMPLIFIER
JESD-30 code	R-PBGA-B16	-	R-PBGA-B16
JESD-609 code	e0	-	e0
Humidity sensitivity level	1	-	1
Number of terminals	16	-	16
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	FBGA	-	FBGA
Encapsulate equivalent code	BGA16,4X4,20	-	BGA16,4X4,20
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	GRID ARRAY	-	GRID ARRAY
power supply	3.3/5 V	-	3.3/5 V
Certification status	Not Qualified	-	Not Qualified
Maximum slew rate	8 mA	-	8 mA
surface mount	YES	-	YES
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)	-	Tin/Lead (Sn63Pb37)
Terminal form	BALL	-	BALL
Terminal pitch	0.5 mm	-	0.5 mm
Terminal location	BOTTOM	-	BOTTOM

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