LMV861 datasheet, PDF - EEWORLD Datasheet

LMV861: Description30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers; File Size980KB，20 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMV861 Overview

30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers

LMV861 Related Products

	LMV861	LMV861MG	LMV861MGX	LMV862	LMV862MM	LMV862MMX
Description	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers	30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers
Is it Rohs certified?	-	incompatible	incompatible	-	incompatible	incompatible
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）	-	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	-	SC-70	SC-70	-	SOIC	SOIC
package instruction	-	SC-70, 5 PIN	SC-70, 5 PIN	-	MSOP-8	MSOP-8
Contacts	-	5	5	-	8	8
Reach Compliance Code	-	_compli	_compli	-	_compli	_compli
ECCN code	-	EAR99	EAR99	-	EAR99	EAR99
Amplifier type	-	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	-	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	-	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	-	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	-	0.0005 µA	0.0005 µA	-	0.0005 µA	0.0005 µA
Nominal Common Mode Rejection Ratio	-	93 dB	93 dB	-	93 dB	93 dB
frequency compensation	-	YES	YES	-	YES	YES
Maximum input offset voltage	-	1260 µV	1260 µV	-	1260 µV	1260 µV
JESD-30 code	-	R-PDSO-G5	R-PDSO-G5	-	S-PDSO-G8	S-PDSO-G8
JESD-609 code	-	e0	e0	-	e0	e0
length	-	2 mm	2 mm	-	3 mm	3 mm
low-bias	-	YES	YES	-	YES	YES
low-dissonance	-	NO	NO	-	NO	NO
micropower	-	NO	NO	-	NO	NO
Humidity sensitivity level	-	1	1	-	1	1
Number of functions	-	1	1	-	2	2
Number of terminals	-	5	5	-	8	8
Maximum operating temperature	-	125 °C	125 °C	-	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-40 °C	-	-40 °C	-40 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSSOP	TSSOP	-	TSSOP	TSSOP
Encapsulate equivalent code	-	TSSOP5/6,.08	TSSOP5/6,.08	-	TSSOP8,.19	TSSOP8,.19
Package shape	-	RECTANGULAR	RECTANGULAR	-	SQUARE	SQUARE
Package form	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	-	TAPE AND REEL	TAPE AND REEL	-	RAIL	TAPE AND REEL
power	-	NO	NO	-	NO	NO
power supply	-	3/5 V	3/5 V	-	3/5 V	3/5 V
Programmable power	-	NO	NO	-	NO	NO
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	-	1.1 mm	1.1 mm	-	1.09 mm	1.09 mm
Nominal slew rate	-	18 V/us	18 V/us	-	18 V/us	18 V/us
Maximum slew rate	-	3.27 mA	3.27 mA	-	6.35 mA	6.35 mA
Supply voltage upper limit	-	6 V	6 V	-	6 V	6 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	-	YES	YES	-	YES	YES
technology	-	CMOS	CMOS	-	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	-	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	-	GULL WING	GULL WING	-	GULL WING	GULL WING
Terminal pitch	-	0.65 mm	0.65 mm	-	0.65 mm	0.65 mm
Terminal location	-	DUAL	DUAL	-	DUAL	DUAL
Nominal Uniform Gain Bandwidth	-	30000 kHz	30000 kHz	-	30000 kHz	30000 kHz
Minimum voltage gain	-	70800	70800	-	70800	70800
broadband	-	NO	NO	-	NO	NO
width	-	1.25 mm	1.25 mm	-	3 mm	3 mm

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