|
LMV861MGX |
LMV861 |
LMV861MG |
LMV862 |
LMV862MM |
LMV862MMX |
| Description |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
- |
incompatible |
incompatible |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
SC-70 |
- |
SC-70 |
- |
SOIC |
SOIC |
| package instruction |
SC-70, 5 PIN |
- |
SC-70, 5 PIN |
- |
MSOP-8 |
MSOP-8 |
| Contacts |
5 |
- |
5 |
- |
8 |
8 |
| Reach Compliance Code |
_compli |
- |
_compli |
- |
_compli |
_compli |
| ECCN code |
EAR99 |
- |
EAR99 |
- |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.0005 µA |
- |
0.0005 µA |
- |
0.0005 µA |
0.0005 µA |
| Nominal Common Mode Rejection Ratio |
93 dB |
- |
93 dB |
- |
93 dB |
93 dB |
| frequency compensation |
YES |
- |
YES |
- |
YES |
YES |
| Maximum input offset voltage |
1260 µV |
- |
1260 µV |
- |
1260 µV |
1260 µV |
| JESD-30 code |
R-PDSO-G5 |
- |
R-PDSO-G5 |
- |
S-PDSO-G8 |
S-PDSO-G8 |
| JESD-609 code |
e0 |
- |
e0 |
- |
e0 |
e0 |
| length |
2 mm |
- |
2 mm |
- |
3 mm |
3 mm |
| low-bias |
YES |
- |
YES |
- |
YES |
YES |
| low-dissonance |
NO |
- |
NO |
- |
NO |
NO |
| micropower |
NO |
- |
NO |
- |
NO |
NO |
| Humidity sensitivity level |
1 |
- |
1 |
- |
1 |
1 |
| Number of functions |
1 |
- |
1 |
- |
2 |
2 |
| Number of terminals |
5 |
- |
5 |
- |
8 |
8 |
| Maximum operating temperature |
125 °C |
- |
125 °C |
- |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
- |
-40 °C |
- |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
- |
TSSOP |
- |
TSSOP |
TSSOP |
| Encapsulate equivalent code |
TSSOP5/6,.08 |
- |
TSSOP5/6,.08 |
- |
TSSOP8,.19 |
TSSOP8,.19 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
- |
SQUARE |
SQUARE |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing |
TAPE AND REEL |
- |
TAPE AND REEL |
- |
RAIL |
TAPE AND REEL |
| power |
NO |
- |
NO |
- |
NO |
NO |
| power supply |
3/5 V |
- |
3/5 V |
- |
3/5 V |
3/5 V |
| Programmable power |
NO |
- |
NO |
- |
NO |
NO |
| Certification status |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.1 mm |
- |
1.1 mm |
- |
1.09 mm |
1.09 mm |
| Nominal slew rate |
18 V/us |
- |
18 V/us |
- |
18 V/us |
18 V/us |
| Maximum slew rate |
3.27 mA |
- |
3.27 mA |
- |
6.35 mA |
6.35 mA |
| Supply voltage upper limit |
6 V |
- |
6 V |
- |
6 V |
6 V |
| Nominal supply voltage (Vsup) |
3.3 V |
- |
3.3 V |
- |
3.3 V |
3.3 V |
| surface mount |
YES |
- |
YES |
- |
YES |
YES |
| technology |
CMOS |
- |
CMOS |
- |
CMOS |
CMOS |
| Temperature level |
AUTOMOTIVE |
- |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
| Terminal surface |
Tin/Lead (Sn85Pb15) |
- |
Tin/Lead (Sn85Pb15) |
- |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
GULL WING |
- |
GULL WING |
- |
GULL WING |
GULL WING |
| Terminal pitch |
0.65 mm |
- |
0.65 mm |
- |
0.65 mm |
0.65 mm |
| Terminal location |
DUAL |
- |
DUAL |
- |
DUAL |
DUAL |
| Nominal Uniform Gain Bandwidth |
30000 kHz |
- |
30000 kHz |
- |
30000 kHz |
30000 kHz |
| Minimum voltage gain |
70800 |
- |
70800 |
- |
70800 |
70800 |
| broadband |
NO |
- |
NO |
- |
NO |
NO |
| width |
1.25 mm |
- |
1.25 mm |
- |
3 mm |
3 mm |