LMH6321_07 datasheet, PDF - EEWORLD Datasheet

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LMH6321_07: DescriptionBUFFER AMPLIFIER, PDSO8; Categorysemiconductor Analog mixed-signal IC; File Size502KB，22 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMH6321_07 Overview

BUFFER AMPLIFIER, PDSO8

LMH6321_07 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum supply/operating voltage	18 V
Maximum operating temperature	125 Cel
Minimum operating temperature	-40 Cel
Rated supply voltage	15 V
Maximum negative supply voltage	-18 V
Rated negative supply voltage	-15 V
Rated rotation rate	2900 V/us
Maximum input offset voltage	52000 mV
Processing package description	PSOP-8
state	ACTIVE
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	1.27 mm
terminal coating	TIN LEAD
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	AUTOMOTIVE
Amplifier type	BUFFER
Minimum output current	0.3000 A
Rated 3dB bandwidth	110 MHz
Maximum input bias current IIB	17 uA

LMH6321_07 Related Products

	LMH6321_07	LMH6321MR	LMH6321MRX	LMH6321TS	LMH6321TSX
Description	BUFFER AMPLIFIER, PDSO8	BUFFER AMPLIFIER, PDSO8	BUFFER AMPLIFIER, PDSO8	BUFFER AMPLIFIER, PDSO8	BUFFER AMPLIFIER, PDSO8
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	7	7
Maximum operating temperature	125 Cel	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C
Maximum input offset voltage	52000 mV	52000 µV	52000 µV	52000 µV	52000 µV
surface mount	Yes	YES	YES	YES	YES
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	SINGLE	SINGLE
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Amplifier type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
Minimum output current	0.3000 A	0.3 A	0.3 A	0.3 A	0.3 A
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	-	SOIC	SOIC	D2PAK	D2PAK
package instruction	-	PSOP-8	PSOP-8	TO-263, 7 PIN	TO-263, 7 PIN
Contacts	-	8	8	7	7
Reach Compliance Code	-	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	-	EAR99	EAR99	EAR99	EAR99
Maximum average bias current (IIB)	-	17 µA	17 µA	17 µA	17 µA
Nominal bandwidth (3dB)	-	110 MHz	110 MHz	110 MHz	110 MHz
Maximum bias current (IIB) at 25C	-	17 µA	17 µA	17 µA	17 µA
JESD-30 code	-	R-PDSO-G8	R-PDSO-G8	R-PSSO-G7	R-PSSO-G7
JESD-609 code	-	e0	e0	e0	e0
length	-	4.93 mm	4.93 mm	10.16 mm	10.16 mm
Humidity sensitivity level	-	3	3	3	3
Negative supply voltage upper limit	-	-18 V	-18 V	-18 V	-18 V
Nominal Negative Supply Voltage (Vsup)	-	-15 V	-15 V	-15 V	-15 V
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	HLSOP	HLSOP	TO-263	TO-263
Encapsulate equivalent code	-	SOP8,.25	SOP8,.25	SMSIP7H,.55,50TB	SMSIP7H,.55,50TB
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	-	260	260	235	235
power supply	-	+-5/+-15 V	+-5/+-15 V	+-5/+-15 V	+-5/+-15 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.68 mm	1.68 mm	4.79 mm	4.79 mm
Nominal slew rate	-	2900 V/us	2900 V/us	2900 V/us	2900 V/us
Maximum slew rate	-	20.5 mA	20.5 mA	20.5 mA	20.5 mA
Supply voltage upper limit	-	18 V	18 V	18 V	18 V
Nominal supply voltage (Vsup)	-	15 V	15 V	15 V	15 V
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	-	40	40	30	30
width	-	3.94 mm	3.94 mm	8.64 mm	8.64 mm

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