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XQFN20092000B

Description
RES,SMT,THIN FILM,9.2K OHMS,100WV,.1% +/-TOL,-250,250PPM TC,0202 CASE
CategoryPassive components    The resistor   
File Size84KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

XQFN20092000B Overview

RES,SMT,THIN FILM,9.2K OHMS,100WV,.1% +/-TOL,-250,250PPM TC,0202 CASE

XQFN20092000B Parametric

Parameter NameAttribute value
Objectid1169360187
package instructionSMT, 0202
Reach Compliance Codeunknown
Country Of OriginUSA
ECCN codeEAR99
YTEOL8.5
structureChip
Manufacturer's serial numberQFN
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length0.51 mm
Package formSMT
Package width0.51 mm
method of packingTray
Rated power dissipation(P)0.025 W
GuidelineMIL-STD-883
resistance9200 Ω
Resistor typeFIXED RESISTOR
seriesQFN
size code0202
technologyTHIN FILM
Temperature Coefficient250 ppm/°C
Tolerance0.1%
Operating Voltage100 V
QFN
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP
RESISTORS
FEATURES
Wire bondable
Product may not
be to scale
Chip size: 0.020 inches square
Resistance range: 10
Ω
to 510 kΩ
Resistor material: Nichrome
Quartz substrate: < 0.1 pF shunt capacitance
The QFN series nichrome on quartz resistor chips offer a
combination of nichrome stability, excellent frequency
response and small size.
The QFNs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFNs are 100 % electrically tested and
visually inspected to MIL-STD-883.
Power: 25 mW
APPLICATIONS
Vishay EFI QFN top-contact resistor chips are widely used in hybrid packages where space is limited. Designed with capacity to
handle substantial power loads, they also have the benefit of nichrome stability.
Recommended for hermetic environments where die is not exposed to moisture.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1%
0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
PROCESS CODE
CLASS H*
203
201
202
200
Gold terminations
*MIL-PRF-38534 inspection criteria
CLASS K*
207
205
206
204
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 360 kΩ 510 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Stability, 1000 h, + 125 °C, 50 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 35 dB typ.
- 20 dB typ.
± 0.1 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
25 mW
± 0.25 % max.
ΔR/R
www.vishay.com
50
For technical questions, contact: efi@vishay.com
Document Number: 61079
Revision: 14-Mar-08
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