EEWORLDEEWORLDEEWORLD

Part Number

Search

LD12GC392KAB3A

Description
Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0039uF, Surface Mount, 1812, CHIP
CategoryPassive components    capacitor   
File Size46KB,2 Pages
ManufacturerAVX
Download Datasheet Parametric View All

LD12GC392KAB3A Overview

Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0039uF, Surface Mount, 1812, CHIP

LD12GC392KAB3A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAVX
package instruction, 1812
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.0039 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.54 mm
JESD-609 codee0
length4.5 mm
Manufacturer's serial numberLD12
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 13 INCH
positive tolerance10%
Rated (DC) voltage (URdc)2000 V
seriesLD(HIGH VOLTAGE)
size code1812
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width3.2 mm
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
AVX Corporation will support those customers for commercial and mili-
tary Multilayer Ceramic Capacitors with a termination consisting of 5%
minimum lead. This termination is indicated by the use of a “B” in the
12th position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our customers. AVX
has provided in the following pages, a full range of values that we are
offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip product. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
LD08
A
A
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%, -20%
A
Test
Level
A = Standard
B
1
A
Special Code
A = Standard
Voltage
Temperature
AVX
600V/630V = C
Coefficient
Style
1000V = A
C0G = A
LD05 - 0805
1500V = S
X7R = C
LD06 - 1206
2000V = G
LD10 - 1210
2500V = W
LD08 - 1808
3000V = H
LD12 - 1812
4000V = J
LD13 - 1825
5000V = K
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
Termination
Packaging
B = 5% Min Pb 1 = 7" Reel
3 = 13" Reel
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
DIMENSIONS
SIZE
(L) Length
t
millimeters (inches)
LD05 (0805)
LD06 (1206)
LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
1.70
2.03
2.54
2.54
3.30
2.54
2.54
Max.
(0.051)
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
(t) terminal min. 0.50 ± 0.25
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
* Reflow soldering only.
84
Talking about software architecture from the perspective of history - object-oriented programming (Part 3)
With the rapid development of computer applications, software has entered the core business of some industries. For example, banking business has been heavily dependent on software. Some bank branches...
bigbat Integrated technical exchanges
What version of RVDS are you using? Why can't I open *.mcp project files with RVDS V4.0? Must I use RVDS V2.0?
What version of RVDS are you using? Why can't I open *.mcp project files with RVDS V4.0? Must I use RVDS V2.0?...
yezhenyu Embedded System
EEWORLD forum members are having a get-together in Xi'an. Friends in Xi'an, please go to this post and sign up.
[size=4][b][color=#0000ff] EEWorld Forum Members Gathering in Xi'an[/color][/b] [b]Time[/b]: 7:00-9:00 pm, August 27 (next Monday) [b][color=#ff0000]Location[/color][/b]: Shangju Hotpot Kitchen (Priva...
okhxyyo Talking
SD card reading and writing problem, some files can be written in, some files cannot be written in...
As the title says, SD card reading and writing problems, some files can be written in, some files cannot be written in... Experts can give me some advice, the file system uses EFSL ARM7---EasyArm2200...
oldhouse05 Embedded System
DCDC input end inrush current problem
I recently used this DCDC circuit. When VIN is powered on, the impact current at the input end will range from a few A to tens of A, and the size varies with the resistance value of R1R2. I soldered t...
CcKk Power technology
Help with graduation project "Calculator programming based on single chip microcomputer"
I need help with my graduation project "Calculator Programming Based on Single Chip Microcomputer" I need to use MCS51 single chip microcomputer and protues simulation urgently~~~...
shenjingbing MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2520  1855  1558  427  1825  51  38  32  9  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号