EEWORLDEEWORLDEEWORLD

Part Number

Search

LD20CA912KAB3A

Description
Ceramic Capacitor, Multilayer, Ceramic, 600V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0091uF, Surface Mount, 2220, CHIP
CategoryPassive components    capacitor   
File Size46KB,2 Pages
ManufacturerAVX
Download Datasheet Parametric View All

LD20CA912KAB3A Overview

Ceramic Capacitor, Multilayer, Ceramic, 600V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0091uF, Surface Mount, 2220, CHIP

LD20CA912KAB3A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAVX
package instruction, 2220
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.0091 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high3.3 mm
JESD-609 codee0
length5.7 mm
Manufacturer's serial numberLD20
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 13 INCH
positive tolerance10%
Rated (DC) voltage (URdc)600 V
seriesLD(HIGH VOLTAGE)
size code2220
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width5 mm
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
AVX Corporation will support those customers for commercial and mili-
tary Multilayer Ceramic Capacitors with a termination consisting of 5%
minimum lead. This termination is indicated by the use of a “B” in the
12th position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our customers. AVX
has provided in the following pages, a full range of values that we are
offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip product. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
LD08
A
A
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%, -20%
A
Test
Level
A = Standard
B
1
A
Special Code
A = Standard
Voltage
Temperature
AVX
600V/630V = C
Coefficient
Style
1000V = A
C0G = A
LD05 - 0805
1500V = S
X7R = C
LD06 - 1206
2000V = G
LD10 - 1210
2500V = W
LD08 - 1808
3000V = H
LD12 - 1812
4000V = J
LD13 - 1825
5000V = K
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
Termination
Packaging
B = 5% Min Pb 1 = 7" Reel
3 = 13" Reel
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
DIMENSIONS
SIZE
(L) Length
t
millimeters (inches)
LD05 (0805)
LD06 (1206)
LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
1.70
2.03
2.54
2.54
3.30
2.54
2.54
Max.
(0.051)
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
(t) terminal min. 0.50 ± 0.25
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
* Reflow soldering only.
84
What is the use of placing the interrupt flag in the interrupt program?
interrupt[PORT_vector]void PORT1(void){if(P1IFG&BIT0){Delay();if(P1IFG&BIT0){Execution body;P1IFG&=~BIT0;}}}Can this remove jitter? I feel that judging the interrupt flag in the interrupt program can ...
maihy1985 Microcontroller MCU
STM32DAC and PWM clock are not synchronized, please help
I use the internal DAC of the stm32L4 chip to generate a sine wave, and then use the timer's PWM to generate a square wave. However, I found through an oscilloscope that the two waveforms are not sync...
lulongqin12 stm32/stm8
Learn Analog + Learn Operational Amplifier Gain Error Design Guide
[i=s]This post was last edited by dontium on 2015-1-23 11:39[/i] [b][size=2]Operational Amplifier Gain Error Design Guide[/size][/b][size=2]deyisupport./blog/b/signalchain/archive/2013/10/01/51518.asp...
machinnneee Analogue and Mixed Signal
How to place component packages outside the Package Keepin area in Allegro
I set the Package Keepin area when drawing the PCB in Allegro. Now I want to place the DB25 connector on the edge of the PCB. Part of the component needs to go beyond the PCB frame, and of course it a...
文心雕龙7 PCB Design
Joined the semiconductor industry since yesterday!
But I don't really know much about this industry, please give me some advice!...
mjiqng Talking
Push button switch.
Is there any problem with the program I wrote? (TM4C123GH6PM) (CCS) Actually it doesn't work. #include #include #include"inc/hw_ints.h" #include"inc/hw_nvic.h" #include"inc/hw_memmap.h" #include"inc/h...
amo_1 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2173  2232  1006  2780  391  44  45  21  56  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号