MB88152A
Spread Spectrum Clock Generator
MB88152A is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary radiation
noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with the internal mod-
ulator. It corresponds to both of the center spread which modulates input frequency as Middle Centered and down
spread which modulates so as not to exceed input frequency.
Features
■
■
■
■
■
■
■
■
■
■
Input frequency : 16.6 MHz to 134 MHz
Output frequency : 16.6 MHz to 134 MHz
Modulation rate :
0.5
,
1.5
(Center spread),
1.0
,
3.0
(Down spread)
Equipped with oscillation circuit: Range of oscillation 16.6 MHz to 48 MHz
Modulation clock output Duty : 40
to 60
Modulation clock Cycle-Cycle Jitter : Less than 100 ps
Low current consumption by CMOS process : 5.0 mA (24 MHz : Typ-sample, no load)
Power supply voltage : 3.3 V
0.3 V
Operating temperature :
Package : SOP 8-pin
40° to
85
C
Cypress Semiconductor Corporation
Document Number: 002-08308 Rev. *A
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised Wednesday, December 28, 2016
MB88152A
Contents
Product Line-up ................................................................ 3
Pin Assignment ................................................................ 3
Pin Description ................................................................. 3
I/O Circuit Type ................................................................. 4
Handling Devices .............................................................. 5
Block Diagram .................................................................. 6
Pin Setting ......................................................................... 7
Modulation enable setting ........................................... 7
SEL modulation rate setting ........................................ 7
Frequency setting ........................................................ 7
Absolute Maximum Ratings ........................................... 9
Recommended Operating Conditions .......................... 10
Electrical Characteristics ............................................... 12
DC Characteristics .................................................... 12
AC Characteristics ..................................................... 13
Output Clock Duty Cycle (tDCC
½
tb/ta) ...................... 15
Input Frequency (fin
½
1/tin) ......................................... 15
Output Slew Rate (SR) .................................................. 15
Cycle-cycle Jitter (tJC
½
| tn
tn
1 |) ......................... 15
Modulation Waveform .................................................... 16
Lock-up Time .................................................................. 17
Oscillation Circuit ........................................................... 18
Interconnection Circuit Example .................................. 19
Example Characteristics ................................................ 20
Ordering Information...................................................... 21
Package Dimension ........................................................ 22
Document History ........................................................... 23
Sales, Solutions, and Legal Information ...................... 24
Document Number: 002-08308 Rev. *A
Page 2 of 24
MB88152A
1. Product Line-up
MB88152A has three kinds of input frequency, and two kinds of modulation type (center/down spread), total six line-ups.
Product
MB88152A-100
MB88152A-101
MB88152A-102
MB88152A-110
MB88152A-111
MB88152A-112
Input/Output Frequency
16.6 MHz to 134 MHz
16.6 MHz to 67 MHz
40 MHz to 134 MHz
16.6 MHz to 134 MHz
16.6 MHz to 67 MHz
40 MHz to 134 MHz
Center spread
No
Yes
Modulation type
Down spread
No
Yes
Modulation enable pin
2. Pin Assignment
TOP VIEW
XIN 1
8 XENS
XIN 1
XOUT 2
MB88152A-100
V
SS
3
SEL 4
8 FREQ1
7 FREQ0
6 V
DD
5 CKOUT
MB88152A-101
XOUT 2
MB88152A-102
7 FREQ
MB88152A-111
V
SS
3
6 V
DD
MB88152A-112
SEL 4
5 CKOUT
MB88152A-110
FPT-8P-M02
FPT-8P-M02
3. Pin Description
Pin name
XIN
XOUT
V
SS
SEL
CKOUT
V
DD
FREQ/FREQ0
XENS/FREQ1
I
O
I/O
1
2
3
4
5
6
7
8
Pin no.
Description
Crystal resonator connection pin/clock input pin
Crystal resonator connection pin
GND pin
Modulation rate setting pin
Modulated clock output pin
Power supply voltage pin
Frequency setting pin
Modulation enable setting pin/frequency setting pin
I
O
I
I
Document Number: 002-08308 Rev. *A
Page 3 of 24
MB88152A
4. I/O Circuit Type
Pin
SEL
FREQ
FREQ0
FREQ1
XENS
Circuit type
Remarks
CMOS hysteresis input
CKOUT
■
■
CMOS output
I
OL
½
4 mA
Note:
For XIN and XOUT pins, refer to “Oscillation
Circuit”.
Document Number: 002-08308 Rev. *A
Page 4 of 24
MB88152A
5. Handling Devices
Preventing Latch-up
A latch-up can occur if, on this device, (a) a voltage higher than V
DD
or a voltage lower than V
SS
is applied to an input or output pin or
(b) a voltage higher than the rating is applied between V
DD
and V
SS
pins. The latch-up, if it occurs, significantly increases the power
supply current and may cause thermal destruction of an element. When you use this device, be very careful not to exceed the max-
imum rating.
Handling unused pins
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Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or
pull-down resistor.
Unused output pin should be opened.
The attention when the external clock is used
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■
Input the clock to XIN pin, and XOUT pin should be opened when you use the external clock.
Please pay attention so that an overshoot and an undershoot do not occur to an input clock of XIN pin.
Power supply pins
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■
Please design connecting the power supply pin of this device by as low impedance as possible from the current supply source.
We recommend connecting electrolytic capacitor (about 10
F) and the ceramic capacitor (about 0.01
F) in parallel between V
SS
and V
DD
pins near the device, as a bypass capacitor.
Oscillation Circuit
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■
Noise near the XIN and XOUT pins may cause the device to malfunction. Design printed circuit boards so that electric wiring of XIN
or XOUT pin and resonator (or ceramic oscillator) do not intersect other wiring.
Design the printed circuit board that surrounds the XIN and XOUT pins with ground.
Document Number: 002-08308 Rev. *A
Page 5 of 24