2.1 General ...................................................................................................................................................................1
2.2 Government documents ..........................................................................................................................................2
2.2.1 Specifications, standards, and handbooks ...........................................................................................................2
2.2.2 Other Government documents, drawings, and publications .................................................................................2
2.4 Order of precedence ...............................................................................................................................................3
3.1 General ...................................................................................................................................................................3
3.1.1 Reference to applicable device specification........................................................................................................3
3.3.1 Manufacturer's review system ..............................................................................................................................5
3.3.3 Self-assessment program ....................................................................................................................................5
3.3.4 Change control procedures ..................................................................................................................................5
3.3.4.1 Discontinuation of products ...............................................................................................................................5
3.4 Requirements for listing on a QML ..........................................................................................................................5
3.4.1.1 Process capability demonstration......................................................................................................................6
3.4.1.1.1 New technology insertion ...............................................................................................................................6
3.4.1.2 Management and technology validation ............................................................................................................7
3.4.1.3.1 Second and third party validations .................................................................................................................7
3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................7
3.4.1.6 Change management system ...........................................................................................................................9
3.4.1.7 Deficiencies and concerns ................................................................................................................................9
3.4.1.8 Letter of certification ..........................................................................................................................................9
3.4.5 Maintenance and retention of QML .................................................................................................................... 10
3.4.6 QML line shutdown ............................................................................................................................................ 10
3.4.8 Performance requirements for class T devices .................................................................................................. 10
3.4.8.1 Class T radiation requirements ....................................................................................................................... 11
3.6 Marking of microcircuits ........................................................................................................................................ 11
3.6.1 Index point.......................................................................................................................................................... 11
3.6.2 Part or identification number (PIN) ..................................................................................................................... 12
3.6.2.2.1 Military designator ........................................................................................................................................ 13
3.6.2.3 Device class designator .................................................................................................................................. 13
3.6.2.4 Case outline .................................................................................................................................................... 13
3.6.2.5 Lead finish ....................................................................................................................................................... 13
3.6.3 Certification mark ............................................................................................................................................... 13
3.6.3.1 QD certification mark ....................................................................................................................................... 13
ii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
3.6.3.2 JAN or J mark ................................................................................................................................................. 14
3.6.4.1 Code for assembly sites .................................................................................................................................. 14
3.6.5 Country of origin ................................................................................................................................................. 14
3.6.6 Date code ........................................................................................................................................................... 14
3.6.7 Marking location and sequence.......................................................................................................................... 14
3.6.9 Marking on container.......................................................................................................................................... 15
3.8 Screening and test ................................................................................................................................................ 15
3.12 ESD control ......................................................................................................................................................... 15
3.13 Recycled, recovered, or environmentally preferable materials ............................................................................ 15
3.14 Alternate test requirements ................................................................................................................................. 16
3.15 Passive elements ................................................................................................................................................ 16
6.1 Intended use ......................................................................................................................................................... 34
6.1.1 Class T ............................................................................................................................................................... 34
6.4.2 Element (of a microcircuit or integrated circuit) .................................................................................................. 34
6.4.3 Substrate (of a microcircuit or integrated circuit) ................................................................................................ 35
6.4.5 Production lot ..................................................................................................................................................... 35
6.4.6 Inspection lot ...................................................................................................................................................... 35
6.4.7 Wafer lot ............................................................................................................................................................. 35
6.4.11 Final seal .......................................................................................................................................................... 35
6.4.13 Qualifying activity (QA) ..................................................................................................................................... 36
6.4.14 Parts per million (PPM) .................................................................................................................................... 36
6.4.15 Device type ...................................................................................................................................................... 36
iii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
6.4.16 Die type ............................................................................................................................................................ 36
6.4.19 Package family ................................................................................................................................................. 36
6.4.22 Third party design center.................................................................................................................................. 36
6.4.23 Radiation source of supply (RSS) .................................................................................................................... 36
6.4.24 Form ................................................................................................................................................................. 36
6.4.25 Fit ..................................................................................................................................................................... 36
6.4.26 Function ........................................................................................................................................................... 36
6.4.27 Class M ............................................................................................................................................................ 37
6.4.28 Class N............................................................................................................................................................. 37
6.4.29 Class Q ............................................................................................................................................................ 37
6.4.30 Class V ............................................................................................................................................................. 37
6.4.31 Class Y ............................................................................................................................................................. 37
6.4.32 Class B ............................................................................................................................................................. 37
6.4.33 Class S ............................................................................................................................................................. 37
6.4.34 Class T ............................................................................................................................................................. 37
6.4.35 Qualified manufacturer’s line ............................................................................................................................ 37
6.4.36 Test optimization .............................................................................................................................................. 37
6.4.37 Audit team ........................................................................................................................................................ 37
6.4.38 Class level B .................................................................................................................................................... 37
6.4.39 Class level S .................................................................................................................................................... 37
6.4.40 Class level vs Class ......................................................................................................................................... 38
6.4.41 Second party facility ......................................................................................................................................... 38
6.4.42 Third party facility ............................................................................................................................................. 38
6.4.43 New technology................................................................................................................................................ 38
6.4.45 Lot date code ................................................................................................................................................... 38
6.4.46 Storage temperature ........................................................................................................................................ 38
6.7 Subject term (key word) listing .............................................................................................................................. 42
6.8 List of acronyms .................................................................................................................................................... 43
6.9 Environmentally preferable material ...................................................................................................................... 45
6.10 Changes from previous issue .............................................................................................................................. 45
A.2.1 General .............................................................................................................................................................. 46
A.2.2 Government documents..................................................................................................................................... 46
A.2.2.1 Specifications, standards, and handbooks...................................................................................................... 46
A.2.2.2 Other Government documents, drawings, and publications............................................................................ 47
A.2.4 Order of precedence .......................................................................................................................................... 48
A.3.1 General .............................................................................................................................................................. 48
A.3.1.1 Reference to device specification or drawing.................................................................................................. 48
A.3.1.3.2 Element (of a microcircuit or integrated circuit) ............................................................................................ 49
iv
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit).......................................................................................... 49
A.3.1.3.4.4 Film microcircuit (or film integrated circuit)................................................................................................ 49
A.3.1.3.6 Production lot ............................................................................................................................................... 50
A.3.1.3.7 Inspection lot - class level S......................................................................................................................... 50
A.3.1.3.8 Inspection lot - class level B......................................................................................................................... 50
A.3.1.3.9 Inspection sublot - class level S ................................................................................................................... 50
A.3.1.3.10 Inspection lot split - class level B ............................................................................................................... 50
A.3.1.3.11 Wafer lot .................................................................................................................................................... 50
A.3.1.3.12 Package type ............................................................................................................................................. 50
A.3.1.3.13 Microcircuit group ...................................................................................................................................... 50
A.3.1.3.17 Final seal ................................................................................................................................................... 51
A.3.1.3.19 Qualifying activity ....................................................................................................................................... 51
A.3.1.3.20 Device type ................................................................................................................................................ 51
A.3.1.3.21 Die type...................................................................................................................................................... 51
A.3.1.3.29 Die family ................................................................................................................................................... 52
A.3.1.3.30 Package family .......................................................................................................................................... 52
A.3.1.3.31 Military operating temperature range ......................................................................................................... 52
A.3.1.3.32 Process monitor ......................................................................................................................................... 52
A.3.1.3.34 Class level B .............................................................................................................................................. 52
A.3.1.3.35 Class level S .............................................................................................................................................. 52
A.3.2.1 Electrical test requirements............................................................................................................................. 52
A.3.2.2.1 Example C of C............................................................................................................................................ 53
A.3.2.2.2 Die evaluation requirements ........................................................................................................................ 54
A.3.3 Classification of requirements ............................................................................................................................ 54
A.3.3.1 Certification of conformance and acquisition traceability ................................................................................ 55
A.3.4.1.2.3 Die attachment.......................................................................................................................................... 56
A.3.4.1.2.4 Lid seal ..................................................................................................................................................... 56
A.3.4.1.2.6 Lead trimming and final lead finish thickness............................................................................................ 57
A.3.4.1.3 Qualification to RHA levels .......................................................................................................................... 57
An example of external interrupt, in this example, non-maskable interrupt is used, interrupt trigger pin GPIO16, trigger mode edge trigger, for your reference. The main program is as follows, and the ...
When I use the STM32F103RCT6to compare the output of the timer, the initialization is set, the interrupt is enabled, and the timer is not enabled. Whenarr psc DutyRatio are all zero and assigned,TIM3-...
[i=s]This post was last edited by 29447945 on 2020-8-31 19:55[/i]We need to use the connection to download the server's files. Here we use openresty to build a file server;
First we need to download o...
A few days ago, I read a book about cross-platform programming in the company. I felt it was very profound! And the understanding of compilers in it was really profound. I personally had a superficial...
Newbie report, please take care!
I applied for an msp430f169 microcontroller and want to learn it myself, but I only heard that it can be downloaded using BSL and JTAG. However, I don't have a minimum...
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
Electric motors and internal combustion engines of the same power have similar torque levels. High power requires high torque, and torque determines a vehicle's acceleration speed, commonly known a...[Details]
Multi-touch mobile phone
Multi-touch is a system that can respond to multiple touches on the screen at the same time. Multi-touch phones are divided into capacitive and resistive types. Capaci...[Details]
introduction
According to the China Fire Statistics Yearbook, electrical fires accounted for more than 30% of fire accidents in the past decade, and the trend is increasing year by year. They ...[Details]
The complexity of the integrated circuits (ICs) used in electronic systems in vehicles is increasing. They aim to execute artificial intelligence (AI) algorithms to control autonomous driving funct...[Details]
Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
Inverter power supplies on the market can generally be divided into two categories: sine wave inverters and square wave inverters. Some engineers also like to categorize pure sine wave inverters as...[Details]
With the advancement of science and technology and the promotion of green, energy-saving, and circular development, the demand for precise control and accurate measurement is increasing. In the pow...[Details]
On August 21, it was reported that Intel's new generation of AI chip Jaguar Shores was recently exposed for the first time.
According to photos shared by Andreas Schilling, the Jaguar Shores t...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
Smartphones can be incredibly unintelligent. For example, consider an office full of people, each absorbed in their work. Suddenly, the silence is broken by a burst of loud pop music. A colleague's...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
introduction
With the development of the information superhighway and the internet, broadcast television has become increasingly widespread worldwide. Television information has emerged in var...[Details]
The Radxa Cubie A7A is a single-board computer (SBC) powered by the Allwinner A733 octa-core Cortex-A76/A55 SoC, equipped with a 3 TOPS AI accelerator and up to 16GB of LPDDR5 memory.
Fo...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
