P27C020-200V10 datasheet, PDF - EEWORLD Datasheet

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P27C020-200V10: DescriptionOTP ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32; Categorystorage storage; File Size318KB，10 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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P27C020-200V10 Overview

OTP ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32

P27C020-200V10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP-32
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	200 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	41.91 mm
memory density	2097152 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.83 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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P27C020-200V10 Related Products

	P27C020-200V10	27C020-200V10	N27C020-200V10	27C020-150V10
Description	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32	UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32	OTP ROM, 256KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32	UVPROM, 256KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32
Parts packaging code	DIP	DIP	QFJ	DIP
package instruction	DIP-32	WDIP,	QCCJ, LDCC32,.5X.6	WDIP,
Contacts	32	32	32	32
Reach Compliance Code	unknow	compli	compli	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	200 ns	200 ns	200 ns	150 ns
JESD-30 code	R-PDIP-T32	R-GDIP-T32	R-PQCC-J32	R-GDIP-T32
length	41.91 mm	42.165 mm	13.97 mm	42.165 mm
memory density	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	OTP ROM	UVPROM	OTP ROM	UVPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	WDIP	QCCJ	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE, WINDOW	CHIP CARRIER	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.83 mm	5.72 mm	3.55 mm	5.72 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL
width	15.24 mm	15.24 mm	11.43 mm	15.24 mm
Base Number Matches	1	1	1	1

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