UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | WDIP, |
| Contacts | 32 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-GDIP-T32 |
| length | 42.165 mm |
| memory density | 2097152 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 27C020-200V10 | N27C020-200V10 | P27C020-200V10 | 27C020-150V10 | |
|---|---|---|---|---|
| Description | UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | OTP ROM, 256KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32 | UVPROM, 256KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 |
| Parts packaging code | DIP | QFJ | DIP | DIP |
| package instruction | WDIP, | QCCJ, LDCC32,.5X.6 | DIP-32 | WDIP, |
| Contacts | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compli | compli | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 200 ns | 150 ns |
| JESD-30 code | R-GDIP-T32 | R-PQCC-J32 | R-PDIP-T32 | R-GDIP-T32 |
| length | 42.165 mm | 13.97 mm | 41.91 mm | 42.165 mm |
| memory density | 2097152 bi | 2097152 bi | 2097152 bi | 2097152 bi |
| Memory IC Type | UVPROM | OTP ROM | OTP ROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | QCCJ | DIP | WDIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.72 mm | 3.55 mm | 4.83 mm | 5.72 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| width | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
京公网安备 11010802033920号
EEWORLD
