D27C020-200V10 datasheet, PDF - EEWORLD Datasheet

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D27C020-200V10: DescriptionUVPROM, 256KX8, 200ns, CMOS, CDIP32,; Categorystorage storage; File Size318KB，10 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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D27C020-200V10 Overview

UVPROM, 256KX8, 200ns, CMOS, CDIP32,

D27C020-200V10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP32,.6
Reach Compliance Code	unknow
Maximum access time	200 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T32
JESD-609 code	e0
memory density	2097152 bi
Memory IC Type	UVPROM
memory width	8
Number of terminals	32
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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D27C020-200V10 Related Products

	D27C020-200V10	LD27C020-200V10	TD27C020-200V10	QD27C020-200V10	D27C020-150V10	N27C020-150V10	P27C020-150V10	L27C020-150V10	T27C020-150V10	Q27C020-150V10
Description	UVPROM, 256KX8, 200ns, CMOS, CDIP32,	UVPROM, 256KX8, 200ns, CMOS, CDIP32	UVPROM, 256KX8, 200ns, CMOS, CDIP32,	UVPROM, 256KX8, 200ns, CMOS, CDIP32	UVPROM, 256KX8, 150ns, CMOS, CDIP32,	OTP ROM, 256KX8, 150ns, CMOS, PQCC32	OTP ROM, 256KX8, 150ns, CMOS, PDIP32,	UVPROM, 256KX8, 150ns, CMOS, CDIP32	UVPROM, 256KX8, 150ns, CMOS, CDIP32	UVPROM, 256KX8, 150ns, CMOS, CDIP32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	200 ns	200 ns	200 ns	200 ns	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T32	R-XDIP-T32	R-XDIP-T32	R-XDIP-T32	R-XDIP-T32	R-PQCC-J32	R-PDIP-T32	R-XDIP-T32	R-XDIP-T32	R-XDIP-T32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	OTP ROM	OTP ROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of terminals	32	32	32	32	32	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	QCCJ	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	LDCC32,.5X.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	1
package instruction	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6	QCCJ, LDCC32,.5X.6	DIP, DIP32,.6	-	DIP, DIP32,.6	DIP, DIP32,.6
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	-	-	0.03 mA	0.03 mA	0.03 mA

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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