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AT17F080-30CI

Description
8M X 1 CONFIGURATION MEMORY, PQCC20
Categorystorage    storage   
File Size218KB,19 Pages
ManufacturerAtmel (Microchip)
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AT17F080-30CI Overview

8M X 1 CONFIGURATION MEMORY, PQCC20

AT17F080-30CI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instructionSON, SOLCC8,.25
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)33 MHz
JESD-30 codeS-XDSO-N8
JESD-609 codee0
length5.99 mm
memory density8388608 bi
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level3
Number of functions1
Number of terminals8
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX1
Package body materialUNSPECIFIED
encapsulated codeSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeSQUARE
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)240
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.14 mm
Maximum standby current0.001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
typeNOR TYPE
width5.99 mm
Maximum write cycle time (tWC)0.03 ms
Features
Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store
Configuration Programs for Field Programmable Gate Arrays (FPGAs)
3.3V Output Capability
5V Tolerant I/O Pins
Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
In-System Programmable (ISP) via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT40K and AT94K Devices, Altera
®
FLEX
®
, APEX
Devices,
Lucent
®
ORCA
®
FPGAs, Xilinx
®
XC3000, XC4000, XC5200, Spartan
®
, Virtex
FPGAs,
Motorola
®
MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 5,000 Write Cycles Typical
LHF Package Available (Lead and Halide Free)
FPGA
Configuration
Flash Memory
AT17F040
AT17F080
1. Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see
Table 1-1.
The AT17F Series Configurator
uses a simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1-1.
Package
8-lead LAP
20-lead PLCC
44-lead PLCC
44-lead TQFP
AT17F Series Packages
AT17F040
Yes
Yes
AT17F080
Yes
Yes
Yes
Yes
3039I–CNFG–2/05

AT17F080-30CI Related Products

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Description 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20
Is it Rohs certified? incompatible conform to incompatible incompatible conform to incompatible conform to incompatible
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code SOIC SOIC LPCC LPCC LPCC LPCC LPCC QFP
package instruction SON, SOLCC8,.25 SON, SOLCC8,.25 QCCJ, LDCC20,.4SQ QCCJ, LDCC20,.4SQ PLASTIC, MS-018AA, LCC-20 QCCJ, LDCC20,.4SQ PLASTIC, MS-018AA, LCC-20 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MS-026ACB, TQFP-44
Contacts 8 8 20 20 20 20 20 44
Reach Compliance Code compli compli compli compli unknow compli unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz
JESD-30 code S-XDSO-N8 S-XDSO-N8 S-PQCC-J20 S-PQCC-J20 S-PQCC-J20 S-PQCC-J20 S-PQCC-J20 S-PQFP-G44
JESD-609 code e0 e4 e0 e0 e3 e0 e3 e0
length 5.99 mm 5.99 mm 8.9662 mm 8.9662 mm 8.9662 mm 8.9662 mm 8.9662 mm 10 mm
memory density 8388608 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 1 1 1 1 1 1 1 1
Humidity sensitivity level 3 3 2 2 2 2 2 3
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 8 8 20 20 20 20 20 44
word count 8388608 words 4194304 words 4194304 words 4194304 words 4194304 words 8388608 words 8388608 words 8388608 words
character code 8000000 4000000 4000000 4000000 4000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C - -40 °C -
organize 8MX1 4MX1 4MX1 4MX1 4MX1 8MX1 8MX1 8MX1
Package body material UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SON SON QCCJ QCCJ QCCJ QCCJ QCCJ TQFP
Encapsulate equivalent code SOLCC8,.25 SOLCC8,.25 LDCC20,.4SQ LDCC20,.4SQ LDCC20,.4SQ LDCC20,.4SQ LDCC20,.4SQ TQFP44,.47SQ,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE SMALL OUTLINE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER FLATPACK, THIN PROFILE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 240 260 225 225 245 225 245 240
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.14 mm 1.14 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm 1.2 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Gold (Au) - with Nickel (Ni) barrie Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD J BEND J BEND J BEND J BEND J BEND GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm
Terminal location DUAL DUAL QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 40 30 30 40 30 40 30
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 5.99 mm 5.99 mm 8.9662 mm 8.9662 mm 8.9662 mm 8.9662 mm 8.9662 mm 10 mm
Maximum write cycle time (tWC) 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms
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Index Files: 2060  1940  2655  2374  70  42  40  54  48  2 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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