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AT17F080-30TQC

Description
8M X 1 CONFIGURATION MEMORY, PQCC20
Categorystorage    storage   
File Size218KB,19 Pages
ManufacturerAtmel (Microchip)
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AT17F080-30TQC Overview

8M X 1 CONFIGURATION MEMORY, PQCC20

AT17F080-30TQC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeQFP
package instruction10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MS-026ACB, TQFP-44
Contacts44
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum clock frequency (fCLK)33 MHz
JESD-30 codeS-PQFP-G44
JESD-609 codee0
length10 mm
memory density8388608 bi
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX1
Package body materialPLASTIC/EPOXY
encapsulated codeTQFP
Encapsulate equivalent codeTQFP44,.47SQ,32
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)240
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
typeNOR TYPE
width10 mm
Maximum write cycle time (tWC)0.03 ms
Features
Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store
Configuration Programs for Field Programmable Gate Arrays (FPGAs)
3.3V Output Capability
5V Tolerant I/O Pins
Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
In-System Programmable (ISP) via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT40K and AT94K Devices, Altera
®
FLEX
®
, APEX
Devices,
Lucent
®
ORCA
®
FPGAs, Xilinx
®
XC3000, XC4000, XC5200, Spartan
®
, Virtex
FPGAs,
Motorola
®
MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 5,000 Write Cycles Typical
LHF Package Available (Lead and Halide Free)
FPGA
Configuration
Flash Memory
AT17F040
AT17F080
1. Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see
Table 1-1.
The AT17F Series Configurator
uses a simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1-1.
Package
8-lead LAP
20-lead PLCC
44-lead PLCC
44-lead TQFP
AT17F Series Packages
AT17F040
Yes
Yes
AT17F080
Yes
Yes
Yes
Yes
3039I–CNFG–2/05

AT17F080-30TQC Related Products

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Description 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20 8M X 1 CONFIGURATION MEMORY, PQCC20
Is it Rohs certified? incompatible conform to incompatible incompatible conform to incompatible incompatible conform to
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code QFP SOIC LPCC LPCC LPCC SOIC LPCC LPCC
package instruction 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MS-026ACB, TQFP-44 SON, SOLCC8,.25 QCCJ, LDCC20,.4SQ QCCJ, LDCC20,.4SQ PLASTIC, MS-018AA, LCC-20 SON, SOLCC8,.25 QCCJ, LDCC20,.4SQ PLASTIC, MS-018AA, LCC-20
Contacts 44 8 20 20 20 8 20 20
Reach Compliance Code unknow compli compli compli unknow compli compli unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz
JESD-30 code S-PQFP-G44 S-XDSO-N8 S-PQCC-J20 S-PQCC-J20 S-PQCC-J20 S-XDSO-N8 S-PQCC-J20 S-PQCC-J20
JESD-609 code e0 e4 e0 e0 e3 e0 e0 e3
length 10 mm 5.99 mm 8.9662 mm 8.9662 mm 8.9662 mm 5.99 mm 8.9662 mm 8.9662 mm
memory density 8388608 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 1 1 1 1 1 1 1 1
Humidity sensitivity level 3 3 2 2 2 3 2 2
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 44 8 20 20 20 8 20 20
word count 8388608 words 4194304 words 4194304 words 4194304 words 4194304 words 8388608 words 8388608 words 8388608 words
character code 8000000 4000000 4000000 4000000 4000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C -40 °C - -40 °C
organize 8MX1 4MX1 4MX1 4MX1 4MX1 8MX1 8MX1 8MX1
Package body material PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TQFP SON QCCJ QCCJ QCCJ SON QCCJ QCCJ
Encapsulate equivalent code TQFP44,.47SQ,32 SOLCC8,.25 LDCC20,.4SQ LDCC20,.4SQ LDCC20,.4SQ SOLCC8,.25 LDCC20,.4SQ LDCC20,.4SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, THIN PROFILE SMALL OUTLINE CHIP CARRIER CHIP CARRIER CHIP CARRIER SMALL OUTLINE CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 240 260 225 225 245 240 225 245
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.14 mm 4.572 mm 4.572 mm 4.572 mm 1.14 mm 4.572 mm 4.572 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Gold (Au) - with Nickel (Ni) barrie Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form GULL WING NO LEAD J BEND J BEND J BEND NO LEAD J BEND J BEND
Terminal pitch 0.8 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL QUAD QUAD QUAD DUAL QUAD QUAD
Maximum time at peak reflow temperature 30 40 30 30 40 30 30 40
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm 5.99 mm 8.9662 mm 8.9662 mm 8.9662 mm 5.99 mm 8.9662 mm 8.9662 mm
Maximum write cycle time (tWC) 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms 0.03 ms

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