OTP ROM, 256X4, 60ns, TTL, CDIP16,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | compli |
| Maximum access time | 60 ns |
| JESD-30 code | R-XDIP-T16 |
| memory density | 1024 bi |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Humidity sensitivity level | 2A |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| 5962-01-162-6620 | 5962-01-135-7860 | 5962-01-113-4970 | 5962-01-120-1249 | 5962-01-252-1495 | 5962-01-124-9549 | 5962-01-132-3325 | 5962-01-162-6618 | |
|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 256X4, 60ns, TTL, CDIP16, | OTP ROM, 256X4, 45ns, TTL, CDIP16, | OTP ROM, 256X4, 60ns, TTL, CDIP16, | OTP ROM, 256X4, 45ns, TTL, CDIP16, | OTP ROM, 256X4, 60ns, TTL, CDIP16, | OTP ROM, 256X4, 60ns, TTL, CDIP16, | OTP ROM, 256X4, 45ns, TTL, CDIP16, | OTP ROM, 256X4, 60ns, TTL, CDIP16, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | compli | compli | compli | compliant | compliant | compli | compli | compli |
| Maximum access time | 60 ns | 45 ns | 60 ns | 45 ns | 60 ns | 60 ns | 45 ns | 60 ns |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| memory density | 1024 bi | 1024 bi | 1024 bi | 1024 bit | 1024 bit | 1024 bi | 1024 bi | 1024 bi |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | - | -55 °C | -55 °C | - | -55 °C |
| organize | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Maker | Fairchild | - | - | Fairchild | - | Fairchild | Fairchild | Fairchild |