CDR33BP162BKZS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> CDR33BP162BKZS

CDR33BP162BKZS: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.0016uF, Surface Mount, 1210, CHIP; CategoryPassive components capacitor; File Size1MB，10 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

CDR33BP162BKZS Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.0016uF, Surface Mount, 1210, CHIP

CDR33BP162BKZS Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	KEMET
package instruction	, 1210
Reach Compliance Code	_compli
ECCN code	EAR99
capacitance	0.0016 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.5 mm
JESD-609 code	e0
length	3.2 mm
Manufacturer's serial number	CDR33
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK; TR, EMBOSSED PLASTIC, 7 INCH
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-55681
series	C(SIZE)N
size code	1210
surface mount	YES
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
width	2.5 mm

Preview

Download Datasheet

View All

CERAMIC CHIP/MIL-PRF-55681

CAPACITOR OUTLINE DRAWINGS

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMET

SIZE

CODE

MIN.

MAX.

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

CDR31

CDR32

CDR33

CDR34

CDR35

C0805

C1805

C1808

C1812

C1825

C2225

C0805

C1206

C1210

C1812

C1825

2.03 ±.38 (.080 ±.015)

4.57 ±.38 (.180 ±.015)

+.51

+.020

4.57

.180

–.38

–.015

5.72 ±.51 (.225 ±.020)

2.00 ±.20 (.078 ±.008)

3.20 ±.20 (.125 ±.008)

3.20 ±.25 (.125 ±.010)

4.50 ±.25 (.176 ±.010)

4.50 ±.30 (.176 ±.012)

(

)

1.27 ±.38 (.050 ±.015)

2.03 ±.38 (.080 ±.015)

3.18 ±.38 (.125 ±.015)

+.51

+.020

6.35

.250

–.38

–.015

6.35 ±.51 (.250 ±.020)

1.25 ±.20 (.049 ±.008)

1.60 ±.20 (.062 ±.008)

2.50 ±.25 (.098 ±.010)

3.20 ±.25 (.125 ±.010)

6.40 ±.30 (.250 ±.012)

.56 (.022)

.51 (.020)

1.40 (.055)

2.03 (.080)

1.30 (.051)

1.50 (.059)

.51 ± 0.25 (.020 ±.010)

.50 ± 0.20 (.020 ±.008)

.50 ± 0.25 (.020 ±.010)

.50 ± 0.30 (.020 ±.012)

(

)

Note:

For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following

amounts:

Length

Width

Length

CDR01

0.51MM (.020)

0.38MM (.015)

CDR02-06

0.64MM (.025)

0.38MM (.015)

CDR31-35

0.60MM (.023)

0.30MM (.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

CDR01

B P

101 B K

STYLE & SIZE CODE

STYLE

C — Ceramic

D — Dielectric, Fixed Chip

R — Established Reliability

FAILURE RATE LEVEL

(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final

(SolderGuard I)

U — Base Metalization—

Barrier Metal—Solder

Coated

(SolderGuard I)

W — Base Metalization—

Barrier Metal—Tinned

Tin or (Tin/Lead Alloy)

SolderGuard II

Y — Base Metalization

Barrier Metal—Tinned

(100% Tin)

Solderguard II

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE

X —± 15%—without voltage

+ 15%, –25%—with voltage

CAPACITANCE

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.

(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

CAPACITANCE TOLERANCE

±.1 pF ±.25 pF ±.5 pF ±1%

±5%

±10% ±20%

Z – Base metallization -

barrier metal-tinned (tin/lead

alloy, with a min. of 4% lead)

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

C 0805

P 101 K

1 G M

CERAMIC

SIZE CODE

See Table Above

END METALIZATION

L — 70Sn/30Pb Plated (Military codes Z,W,U )

C— 100% Tin Plated (Military code Y)

H – Sn60 Coated (Military code S)

SPECIFICATION

P -MIL-PRF-55681 = CDR01-CDR06

N-MIL-PRF-55681 = CDR31-CDR35

FAILURE RATE

(%/1,000 hrs.)

R — 0.01

S — 0.001

M — 1.0

P — 0.1

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

VOLTAGE TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G — BP (C0G/NP0) (±30 PPM/°C)

X — BX (±15% Without Voltage

+15% -25% With Voltage)

CAPACITANCE TOLERANCE

.1 pF

.25 pF

.5 pF

10%

20%

VOLTAGE

1 — 100V, 5 — 50V

Part Number Example: C0805P101K1GML

(14 digits - no spaces)

Ceramic Surface Mount

M — 1.0

P — 0.1

R — 0.01

S — 0.001

Recommended Resources

CO2 gas shielded electromagnetic vibration arc surfacing welding power supply equipment circuit

"Strange trick" amplifier

Travel shaver power conversion circuit

LM386 power amplifier circuit

Measurement amplifier circuit using programmable integrated operational amplifier

Microwave alarm circuit composed of RD627

About Embedded PCI Cards: Our PCI card has uclinux operating system, which can be configured in master-slave mode. Now it is configured in slave mode and plugged into a PC. The card has been burned with redboot, kernel and fil...; happepipi Embedded System

A picture book about people and the environment~~: A few days ago, there was a post talking about smog and environmental protection. Yesterday, my child suddenly mentioned a book title. After looking at the content, I felt that it was related. I would...; soso Talking

Hardware Design Guide for TMS320F28xx and TMS320F28xxx DSCs: Hardware Design Guide for TMS320F28xx and TMS320F28xxx DSCs...; fish001 DSP and ARM Processors

The program runs in SDRAM, how to configure the SCT file?: I want to run an independent executable program in SRAM. The approach I take is as follows: 1. First write a simple copy program and run it in the on-chip FLASH. It is responsible for copying the new ...; zyzs50 NXP MCU

Upload: Oh my god... Why can't it be uploaded? Wow... I'm speechless... My new coins are almost gone... You are not allowed to spam...; liuyong1989 MCU

Would I say this is the graduation thesis topic that others begged me for more than 100 times but still couldn't get?: 1.Power control based on Stackelberg game in wireless data network 2.Application of kinetic energy theorem and law of conservation of mechanical energy 3.Simulation analysis of service model in broadb...; icbuy520 Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components