L8C202KC35 datasheet, PDF - EEWORLD Datasheet

L8C202KC35: DescriptionFIFO, 1KX9, 35ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32; Categorystorage storage; File Size532KB，12 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L8C202KC35 Overview

FIFO, 1KX9, 35ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	QFJ
package instruction	QCCN,
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	35 ns
Other features	RETRANSMIT
period time	45 ns
JESD-30 code	R-CQCC-N32
length	14 mm
memory density	9216 bi
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.048 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

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