|
TIBPAL20L8-5CFN |
TIBPAL20L8-5CNT |
| Description |
SPLD - Simple Programmable Logic Devices High-Performance Impact-X PAL Circuit |
SPLD - Simple Programmable Logic Devices High-Performance Impact-X PAL Circuit |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Contains lead |
Lead free |
| Is it Rohs certified? |
incompatible |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QLCC |
DIP |
| package instruction |
PLASTIC, LCC-28 |
PLASTIC, DIP-24 |
| Contacts |
28 |
24 |
| Reach Compliance Code |
_compli |
compli |
| Other features |
REGISTER PRELOAD; POWER-UP RESET |
REGISTER PRELOAD; POWER-UP RESET |
| Architecture |
PAL-TYPE |
PAL-TYPE |
| maximum clock frequency |
74 MHz |
111 MHz |
| JESD-30 code |
S-PQCC-J28 |
R-PDIP-T24 |
| JESD-609 code |
e3 |
e4 |
| length |
11.5062 mm |
31.64 mm |
| Dedicated input times |
14 |
14 |
| Number of I/O lines |
6 |
6 |
| Number of entries |
20 |
20 |
| Output times |
8 |
8 |
| Number of product terms |
64 |
64 |
| Number of terminals |
28 |
24 |
| Maximum operating temperature |
75 °C |
75 °C |
| organize |
14 DEDICATED INPUTS, 6 I/O |
14 DEDICATED INPUTS, 6 I/O |
| Output function |
COMBINATORIAL |
COMBINATORIAL |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
DIP |
| Encapsulate equivalent code |
LDCC28,.5SQ |
DIP24,.3 |
| Package shape |
SQUARE |
RECTANGULAR |
| Package form |
CHIP CARRIER |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
220 |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
| Programmable logic type |
OT PLD |
OT PLD |
| propagation delay |
7 ns |
7 ns |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.57 mm |
5.08 mm |
| Maximum supply voltage |
5.25 V |
5.25 V |
| Minimum supply voltage |
4.75 V |
4.75 V |
| Nominal supply voltage |
5 V |
5 V |
| surface mount |
YES |
NO |
| technology |
TTL |
TTL |
| Temperature level |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
| Terminal surface |
Matte Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
J BEND |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
2.54 mm |
| Terminal location |
QUAD |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
11.5062 mm |
7.62 mm |