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MT8JSF12864HZ-1G1D1

Description
DDR DRAM Module, 128MX64, CMOS, HALOGEN FREE, MO-268, SODIMM-204
Categorystorage    storage   
File Size340KB,16 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT8JSF12864HZ-1G1D1 Overview

DDR DRAM Module, 128MX64, CMOS, HALOGEN FREE, MO-268, SODIMM-204

MT8JSF12864HZ-1G1D1 Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeSODIMM
package instructionDIMM,
Contacts204
Reach Compliance Codeunknow
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N204
length67.6 mm
memory density8589934592 bi
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals204
word count134217728 words
character code128000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum seat height30.15 mm
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
width30 mm
1GB, 2GB (x64, SR) 204-Pin Halogen-Free DDR3 SDRAM SO-
DIMM
Features
DDR3 SDRAM SODIMM
MT8JSF12864HZ – 1GB
MT8JSF25664HZ – 2GB
Features
• DDR3 functionality and operations supported as
defined in the component data sheet
• 204-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
• 1GB (128 Meg x 64)
• 2GB (256 Meg x 64)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Single rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 204-Pin SODIMM (MO-268 R/C B)
Module height: 30mm (1.18in)
• Operating temperature
1
– Commercial (0°C
T
A
+70°C)
– Industrial (–40°C
T
A
+85°C)
• Package
– 204-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
Note:
Options
Marking
None
I
Z
-1G6
-1G4
-1G1
1. Contact Micron for industrial temperature
module offerings.
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef83364a85
jsf8c128_256x64hz.pdf - Rev. E 04/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2010 Micron Technology, Inc. All rights reserved.
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