LF357AJ datasheet, PDF - EEWORLD Datasheet

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LF357AJ: DescriptionOperational Amplifier, 1 Func, 2300uV Offset-Max, CDIP8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size505KB，9 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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LF357AJ Overview

Operational Amplifier, 1 Func, 2300uV Offset-Max, CDIP8

LF357AJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Reach Compliance Code	unknow
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES (AVCL>=5)
Maximum input offset voltage	2300 µV
JESD-30 code	R-XDIP-T8
JESD-609 code	e0
low-bias	YES
low-dissonance	NO
Number of functions	1
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-15/+-20 V
Certification status	Not Qualified
surface mount	NO
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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LF357AJ Related Products

	LF357AJ	LF357BJ	LF357J	LF357N
Description	Operational Amplifier, 1 Func, 2300uV Offset-Max, CDIP8	Operational Amplifier, 1 Func, 6500uV Offset-Max, CDIP8	Operational Amplifier, 1 Func, 10000uV Offset-Max, JFET, CDIP8, CERAMIC, DIP-8	Operational Amplifier, 1 Func, 13000uV Offset-Max, PDIP8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknow	unknown	unknown	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES (AVCL>=5)	YES (AVCL>=5)	YES (AVCL>=5)	YES (AVCL>=5)
Maximum input offset voltage	2300 µV	6500 µV	10000 µV	13000 µV
JESD-30 code	R-XDIP-T8	R-XDIP-T8	R-GDIP-T8	R-PDIP-T8
JESD-609 code	e0	e0	e0	e0
low-bias	YES	YES	YES	YES
low-dissonance	NO	NO	NO	NO
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	+-15/+-20 V	+-15/+-20 V	+-15 V	+-15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	Motorola ( NXP )	-	Motorola ( NXP )	Motorola ( NXP )
package instruction	-	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3
Maximum bias current (IIB) at 25C	-	0.0001 µA	0.0002 µA	0.0002 µA

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