IC COMPARATOR, CDIP14, Comparator
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Amplifier type | COMPARATOR |
| Maximum bias current (IIB) at 25C | 0.25 µA |
| Maximum input offset voltage | 15000 µV |
| JESD-30 code | R-CDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal response time | 1300 ns |
| Maximum slew rate | 2.5 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| LM2901F | LM339AN | LM139AN | LM239AF | |
|---|---|---|---|---|
| Description | IC COMPARATOR, CDIP14, Comparator | IC,VOLT COMPARATOR,QUAD,BIPOLAR,DIP,14PIN,PLASTIC | IC,VOLT COMPARATOR,QUAD,BIPOLAR,DIP,14PIN,PLASTIC | IC QUAD COMPARATOR, 2000 uV OFFSET-MAX, 1300 ns RESPONSE TIME, CDIP14, Comparator |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknow |
| Amplifier type | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| Maximum input offset voltage | 15000 µV | 4000 µV | 4000 µV | 2000 µV |
| JESD-30 code | R-CDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-CDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 70 °C | 125 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -55 °C | -25 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal response time | 1300 ns | 1300 ns | 1300 ns | 1300 ns |
| Maximum slew rate | 2.5 mA | 2 mA | 2 mA | 2 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 15 V |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | INDUSTRIAL | COMMERCIAL | MILITARY | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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