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2614-25N

Description
Standard SRAM, 1KX4, 250ns, MOS, PDIP18
Categorystorage    storage   
File Size210KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

2614-25N Overview

Standard SRAM, 1KX4, 250ns, MOS, PDIP18

2614-25N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP18,.3
Reach Compliance Codeunknow
Maximum access time250 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T18
JESD-609 codee0
memory density4096 bi
Memory IC TypeSTANDARD SRAM
memory width4
Number of terminals18
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

2614-25N Related Products

2614-25N 2614-15F 2614-25F
Description Standard SRAM, 1KX4, 250ns, MOS, PDIP18 Standard SRAM, 1KX4, 150ns, MOS, CDIP18 Standard SRAM, 1KX4, 250ns, MOS, CDIP18
Is it Rohs certified? incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP18,.3 DIP, DIP18,.3 DIP, DIP18,.3
Reach Compliance Code unknow unknown unknow
Maximum access time 250 ns 150 ns 250 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-PDIP-T18 R-XDIP-T18 R-XDIP-T18
JESD-609 code e0 e0 e0
memory density 4096 bi 4096 bit 4096 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4
Number of terminals 18 18 18
word count 1024 words 1024 words 1024 words
character code 1000 1000 1000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 1KX4 1KX4 1KX4
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP
Encapsulate equivalent code DIP18,.3 DIP18,.3 DIP18,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
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