5962-9220301MSA datasheet, PDF

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5962-9220301MSA: DescriptionBus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, FP-20; Categorylogic logic; File Size338KB，16 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/

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5962-9220301MSA Overview

Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, FP-20

5962-9220301MSA Parametric

Parameter Name	Attribute value
Maker	Pyramid Semiconductor Corporation
package instruction	FP-20
Reach Compliance Code	compli
series	FCT
JESD-30 code	R-GDFP-F20
length	13.09 mm
Logic integrated circuit type	BUS DRIVER
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
propagation delay (tpd)	7 ns
Filter level	MIL-STD-883
Maximum seat height	2.54 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.92 mm

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Application Report

SZZA047 - July 2004

Semiconductor Packing Material

Electrostatic Discharge (ESD) Protection

Albert Escusa and Lance Wright

ABSTRACT

Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)

standard packing methodology were subjected to electrical discharges between 0.5 and 20

kV, as generated by an IEC ESD simulator to determine the level of ESD protection provided

by the packing materials. The testing included trays, tape and reel, and magazines.

Additional units were subjected to the same discharge, without the protection of the packing

material. Test results showed that the packing materials used by TI provide protection up to

20 kV, and that a level of ESD protection is required. The die in the components had a Charge

Device Model (CDM) rating of 0.5 kV, and all units experiencing a discharge greater than 500

V sustained sufficient electrical overstress to fail electrical testing when outside of the packing

materials.

Standard Linear and Logic

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Packing Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 Tube Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Tray Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Tape-and-Reel Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test Equipment and Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.1 Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.2 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4.1 3M SED Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4.2 IEC ESD Simulator Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . 6

Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5.1 Tray-Stack Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5.1.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5.1.2 Tray Packing Results on Live TSSOP Devices Using IED Gun . . . . . . . . . . . . . . . . . . 8

5.2 Tape-and-Reel Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2.2 Tape-and-Reel Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . 10

5.3 Tube Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.3.1 Tube Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.3.2 Tube Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . 12

5.4 Results of Unpackaged Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks are the property of their respective owners.

SZZA047

Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

List of Figures

10.

11.

Event-Detector Locations in Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Tray Stack in Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Event-Detector Locations in Reel (Used 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Carrier-Tape Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Tape-and-Reel Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Event-Detector Locations in Magazine Bundle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Bundle of Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Tube Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Carbon-Lined Bag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Test Socket for Live Die Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

List of Tables

10.

11.

12.

13.

14.

Test Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Event-Detector Feedback for Black PPE-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . . 7

Event-Detector Feedback for Blue Dipped-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . 7

ESD Testing on Live TSSOP Devices for Black PPE-Tray Packing Configurations . . . . . . . . . . . . 8

ESD Testing on Live TSSOP Devices for Blue Dipped-Tray Packing Configurations . . . . . . . . . . 8

Event-Detector Feedback for Black Static-Dissipative-Reel Packing Configurations . . . . . . . . . . . 9

Event-Detector Feedback for Blue Dipped-Reel Packing Configurations . . . . . . . . . . . . . . . . . . . . 10

ESD Testing on Live TSSOP Devices for Black Reel Packing Configurations . . . . . . . . . . . . . . . 10

ESD Testing on Live TSSOP Devices for Blue Dipped-Reel Packing Configurations . . . . . . . . . 10

Event-Detector Feedback for Clear Antistatic Tube Packing Configurations . . . . . . . . . . . . . . . . . 11

Event-Detector Feedback for Black Tube Packing Configurations . . . . . . . . . . . . . . . . . . . . . . . . . 12

ESD Testing on Live TSSOP Devices for Clear Antistatic Tube Packing Configurations . . . . . . 12

ESD Testing on Live TSSOP Devices for Black Tube Packing Configurations . . . . . . . . . . . . . . . 12

ESD Ground-Pin Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

SZZA047

Introduction

Texas Instruments (TI) ships over 5-billion semiconductor devices on an annual basis. To ensure

that these devices reach the customer in good condition, they must be packaged appropriately

to withstand the potential damage of shipping. Semiconductor packing materials must protect

the units from physical damage, vibration shock, and electrostatic discharge (ESD).

Static electricity is a natural phenomenon. Delicate electronic components are easily damaged

by ESD, and subsequent faults in assembled finished products can be costly. Packing media is

used to protect against ESD, as ICs are delivered to the customer and include items such as

trays, tape and reel, tubes or magazines, boxes, and bags. These items must have a surface

resistance in the static dissipate range of greater than 1x10

Ω/sq,

but less than 1x10

Ω/sq

per

ANSI/EOS/ESD S11.11-2001, in order to control a discharge. If the surface resistance is too

small, a charge can dissipate too quickly and electrically overstress the ICs within the packing

medium.

The purpose of this application report is to demonstrate that TI packing methods provide

sufficient ESD protection when used in accordance with EIA-541 and EIA-625 material-handling

guidelines. Packing methods in use today by TI are tape and reel, tray, and tubes. A typical logic

device has minimum ESD criteria, unless approved by a waiver from the Quality department:

[Human-Body Model (HBM), 2000 V] [Charge-Device Model (CDM), 500 V]. The testing

performed in this study was done using a die meeting these minimum requirements, and the

testing performed simulated the CDM. For more information on HBM and CDM, please see the

TI application report,

Electrostatic Discharge (ESD),

literature number SSYA010, located at

www.ti.com.

2.1

Packing Methods

Tube Packing Method

When a customer receives devices packed in tubes, they receive a carbon-lined cardboard box

for surface-mount components. The surface-mount technology (SMT) components are wrapped

in bubble wrap that has an antistatic coating if the moisture sensitivity rating is level 1 (MSL 1). If

not, the tubes are put in a moisture-barrier bag (MBB) and placed in a cardboard box. For

through-hole components, the tubes are shipped inside a carbon-lined bag. Through-hole

components are not moisture sensitive and do not require drypack in an MBB.

2.2

Tray Packing Method

Trays are sent to the customer in a stacked arrangement. There is 4+1, 5+1, or 10+1 tray

stacking, which means that 4, 5, or 10 trays have units with a top tray that is empty. The top tray

acts as a cover. A single carbon-lined cardboard sheet is put on the top and bottom of the tray

stack and bound together with a conductive plastic strap. If the devices are moisture sensitive,

the bundle is drypacked in an MBB and placed in a box with a carbon-lined insert/sleeve. The

top and bottom cardboard sheets and insert provide the Faraday cage (ESD shielding). If the

units are not moisture sensitive, the bundle is wrapped in antistatic bubble wrap and placed in a

non-carbon-lined box.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

SZZA047

Test Procedure

ESD testing consists of two tests. The first test uses a 37-V Static Event Detector (SED),

manufactured by 3M. The detector is placed within the packing materials (see Figures 1, 4,

and 7) to simulate a “packaged” device. The IEC ESD simulator then is used to discharge 0.5 kV

to 20 kV on the packing configuration. The detector window turns red if it has been exposed to

>37 V. SEDs that experience 37 V indicate that more testing is needed, as the device may be

susceptible to damage due to ESD by exposure to voltages greater than 500 V. The minimum

voltage chosen was 0.5 kV, as this is the CDM ESD rating standard TI die. The maximum

voltage chosen was 20 kV, since it is the maximum value that can be discharged in an

exceptionally low-humidity environment when all handling is in accordance with EIA 541/625.

The second test is a repeat of the first test, with known good devices being packed instead of

SEDs. Additionally, this device is placed in a test socket (see Figure 11) and the discharge is

made directly to the ground pins. For this test, a 48-pin TSSOP package was chosen with a

SSTV16857 Rev C die. This die was chosen because it has the minimum allowable values for

HBM and CDM, which are 2000 and 500 V, respectively. These two tests relate to ESD

sensitivity and are described in detail in TI application report,

Electrostatic Discharge (ESD),

literature number SSYA010. Devices with lower values must have a waiver from QA prior to

production shipping. The premise for this test is that no failures prove that TI packing

methodology is sufficient in accordance with the EIA 541/625 ESD packing material and

handling guidelines that TI follows.

The ESD simulator chosen in this study complies with the industry specification IEC 61000-4-2

for system-level ESD evaluation. It generates a more severe stress compared to those specified

in the JEDEC standards of JESD22-A104 for component-level HBM and JESD22-C101 for

component-level CDM. The stress generated by the ESD simulator includes both

component-level HBM and CDM stresses. In addition, at a same-stress voltage level, the

ESD simulator produces an ESD pulse of a greater magnitude than those of the

component-level HBM and CDM stresses. The component-level HBM and CDM tests are

specified in the JEDEC standards and are included in the TI internal specifications for device

qualification. The minimum requirements are 2000 V for HBM and 500 V for CDM. A device with

marginal ESD performance, in accordance with the TI ESD specification, was chosen in this

study.

4.1

3M SED Procedure for Trays/Tape and Reel/Tubes

1. Reset all 37-V SEDs by swiping next to a magnet.

2. Distribute the detectors evenly in the packing material as shown in Figures 1, 4, and 7.

3. Shoot the ESD generator at six different spots around the packing material and record the

result.

4. Perform the same test on the other packing configurations, as shown in the test matrix.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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