IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | _compli |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDIP-T16 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.0013 A |
| Number of digits | 6 |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Prop。Delay @ Nom-Su | 150 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 5962-01-073-8914 | 5962-01-224-1965 | 5962-01-324-1857 | CD4503BE98 | 5962-01-264-9836 | 5962-01-208-9466 | 5962-01-199-7504 | 5962-01-206-2292 | 5962-01-272-0111 | CD4503BEX98 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli | _compli |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.0013 A | 0.0013 A | 0.0014 A | 0.0014 A | 0.0013 A | 0.0013 A | 0.0013 A | 0.0013 A | 0.0013 A | 0.0014 A |
| Number of digits | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Prop。Delay @ Nom-Su | 150 ns | 150 ns | - | - | - | - | 150 ns | 150 ns | 150 ns | 150 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |