5962-01-272-0111 datasheet, PDF

Datasheet> All Categories > logic> logic> 5962-01-272-0111

5962-01-272-0111: DescriptionIC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size477KB，7 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

Download Datasheet Parametric Compare View All

5962-01-272-0111 Overview

IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC

5962-01-272-0111 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	_compli
Control type	ENABLE LOW
JESD-30 code	R-XDIP-T16
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.0013 A
Number of digits	6
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Prop。Delay @ Nom-Su	150 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

Preview

Download Datasheet

View All

5962-01-272-0111 Related Products

	5962-01-272-0111	5962-01-224-1965	5962-01-324-1857	CD4503BE98	5962-01-264-9836	5962-01-208-9466	5962-01-073-8914	5962-01-199-7504	5962-01-206-2292	CD4503BEX98
Description	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,2-BIT/4-BIT,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	_compli	_compli	not_compliant	not_compliant	not_compliant	not_compliant	_compli	_compli	_compli	_compli
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.0013 A	0.0013 A	0.0014 A	0.0014 A	0.0013 A	0.0013 A	0.0013 A	0.0013 A	0.0013 A	0.0014 A
Number of digits	6	6	6	6	6	6	6	6	6	6
Number of functions	2	2	2	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Prop。Delay @ Nom-Su	150 ns	150 ns	-	-	-	-	150 ns	150 ns	150 ns	150 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-

Recommended Resources

Touch lighting delay switch circuit 2

LASER310 learning machine circuit diagram

Projection lamp voltage stabilizing circuit

400V DC switching circuit

±15v tracking regulated power supply four

UHF transmitter module CS901 composed of SAW

The difference between MCU interface and RGB interface: There are many types of LCD screen interfaces, and the classification is also very detailed. This mainly depends on the driving and control methods of the LCD screen. Currently, most LCD screens on th...; 罗姆液晶技术站 Integrated technical exchanges

[MSP430 Sharing] Design of Ship Anti-collision Positioning System Based on Laser Ranging*: This paper introduces the design principle of a ship anti-collision positioning alarm system based on laser ranging, and gives the hardware design and program design method of the system. The laser ra...; 鑫海宝贝 Microcontroller MCU

Give TI SensorTag a companion: Make a Master host device (let's exaggerate a little, call it iHand, I don't know if there is anything else with this name, or it can be called TI iHand) to match SensorTag. Solve the troubles of many...; wangfuchong Wireless Connectivity

Disable automatic sleep in Windows CE: How to cancel automatic sleep in Windows CE? How to write to the registry? Or how to call API? Please help!...; myq412 Embedded System

Question about PC/104 bus drive current: I would like to ask an expert, I use AMD LX800 PC/104 CPU module. I stack 2 serial port modules, 1 CAN module and 1 20-way output relay module. I want to ask: Under the premise that the power consumpt...; yulu3518 Embedded System

Baidu Finance will be launched next month, and its returns will be higher than Yu'ebao: [p=27, 2, left][color=rgb(51, 51, 51)][font=宋体][size=16px]On the afternoon of September 26, according to people close to Baidu, Baidu's financial products may be launched in October. Recently, the off...; qinkaiabc Talking

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components