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HM9-7680-8

Description
HM9-7680-8
Categorystorage    storage   
File Size393KB,6 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM9-7680-8 Overview

HM9-7680-8

HM9-7680-8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Code_compli
Maximum access time90 ns
JESD-30 codeR-XDFP-F24
JESD-609 codee0
memory density8192 bi
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1KX8
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL

HM9-7680-8 Related Products

HM9-7680-8 HM1-7680-5 HM9-7680-5 HM3-7680-5 HM1-7680-2 HM1-7680-7 HM9-7680-2 HM1-7680-8 HM9-7680-7
Description HM9-7680-8 HM1-7680-5 HM9-7680-5 HM3-7680-5 HM1-7680-2 HM1-7680-7 HM9-7680-2 HM1-7680-8 HM9-7680-7
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Reach Compliance Code _compli not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli _compli
Maximum access time 90 ns 70 ns 70 ns 70 ns 90 ns 70 ns 90 ns 90 ns 70 ns
JESD-30 code R-XDFP-F24 R-XDIP-T24 R-XDFP-F24 R-PDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDFP-F24 R-XDIP-T24 R-XDFP-F24
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 8192 bi 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bi 8192 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000 1000 1000 1000
Maximum operating temperature 125 °C 70 °C 70 °C 70 °C 125 °C 70 °C 125 °C 125 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP DIP DFP DIP DIP DIP DFP DIP DFP
Encapsulate equivalent code FL24,.4 DIP24,.6 FL24,.4 DIP24,.6 DIP24,.6 DIP24,.6 FL24,.4 DIP24,.6 FL24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK IN-LINE IN-LINE IN-LINE FLATPACK IN-LINE FLATPACK
surface mount YES NO YES NO NO NO YES NO YES
technology TTL TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified -
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