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HM1-7680-7

Description
HM1-7680-7
Categorystorage    storage   
File Size393KB,6 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM1-7680-7 Overview

HM1-7680-7

HM1-7680-7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Codenot_compliant
Maximum access time70 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

HM1-7680-7 Related Products

HM1-7680-7 HM1-7680-5 HM9-7680-5 HM3-7680-5 HM1-7680-2 HM9-7680-2 HM1-7680-8 HM9-7680-8 HM9-7680-7
Description HM1-7680-7 HM1-7680-5 HM9-7680-5 HM3-7680-5 HM1-7680-2 HM9-7680-2 HM1-7680-8 HM9-7680-8 HM9-7680-7
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli _compli _compli
Maximum access time 70 ns 70 ns 70 ns 70 ns 90 ns 90 ns 90 ns 90 ns 70 ns
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDFP-F24 R-PDIP-T24 R-XDIP-T24 R-XDFP-F24 R-XDIP-T24 R-XDFP-F24 R-XDFP-F24
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bi 8192 bi 8192 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000 1000 1000 1000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C 125 °C 125 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DFP DIP DIP DFP DIP DFP DFP
Encapsulate equivalent code DIP24,.6 DIP24,.6 FL24,.4 DIP24,.6 DIP24,.6 FL24,.4 DIP24,.6 FL24,.4 FL24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE FLATPACK FLATPACK
surface mount NO NO YES NO NO YES NO YES YES
technology TTL TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE FLAT FLAT
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
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