HY5116404CSLT-50 datasheet, PDF

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HY5116404CSLT-50: DescriptionEDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24; Categorystorage storage; File Size102KB，9 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY5116404CSLT-50 Overview

EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24

HY5116404CSLT-50 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP24/26,.36
Contacts	26
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
length	17.14 mm
memory density	16777216 bi
Memory IC Type	EDO DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP24/26,.36
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.2 mm
self refresh	YES
Maximum standby current	0.0003 A
Maximum slew rate	0.11 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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HY5117404C,HY5116404C

4Mx4, Extended Data Out mode

DESCRIPTION

This family is a 16M bit dynamic RAM organized 4,194,304 x 4-bit configuration with Extended Data Out mode CMOS

DRAMs. Extended data out mode is a kind of page mode which is useful for the read operation. The circuit and process

design allow this device to achieve high performance and low power dissipation. Optional features are access time(50, 60

or 70ns) and refresh cycle(2K ref. or 4K ref.) and power consumption (Normal or Low power with self refresh). Hyundai’s

advanced circuit design and process technology allow this device to achieve high bandwidth, low power consumption and

high reliability.

FEATURES

Extended data out operation

Read-modify-write Capability

TTL compatible inputs and outputs

/CAS-before-/RAS, /RAS-only, Hidden and

Self refresh capability

Max. Active power dissipation

Speed

Refresh cycle

Part number

HY5117404C

HY5116404C

Refresh

Normal

32ms

256ms

64ms

SL-part

2K refresh

798mW

660mW

550mW

4K refresh

605mW

495mW

440mW

JEDEC standard pinout

24/26-pin Plastic SOJ (300mil)

24/26-pin Plastic TSOP-II (300mil)

Single power supply of 5V

10%

Early write or output enable controlled write

Fast access time and cycle time

Speed

tRAC

50ns

60ns

70ns

tCAC

13ns

15ns

18ns

tHPC

20ns

25ns

30ns

ORDERING INFORMATION

Part Name

HY5117404CJ

HY5117404CSLJ

HY5117404CT

HY5117404CSLT

HY5116404CJ

HY5116404CSLJ

HY5116404CT

HY5116404CSLT

*SL : Low power with self refresh

This document is a general product description and is subject to change without notice. Hyundai electronics does not assume any responsibility for use of

circuits described. No patent licences are implied

Hyundai Semiconductor

Rev. 10/Sep.97

Refresh

Power

Package

24/26Pin SOJ

SL-part

24/26Pin SOJ

24/26Pin TSOP-II

SL-part

24/26Pin TSOP-II

24/26Pin SOJ

SL-part

24/26Pin SOJ

24/26Pin TSOP-II

SL-part

24/26Pin TSOP-II

HY5116404CSLT-50 Related Products

	HY5116404CSLT-50	HY5116404CSLT-70	HY5116404CSLJ-60	HY5116404CJ-60	HY5116404CJ-70	HY5116404CSLJ-50	HY5116404CT-60	HY5116404CT-50	HY5116404CJ-50	HY5116404CSLT-60
Description	EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24	EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24	EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24	EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24	EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24	EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24	EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24	EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24	EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24	EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	TSOP2	TSOP2	SOJ	SOJ	SOJ	SOJ	TSOP2	TSOP2	SOJ	TSOP2
package instruction	TSOP2, TSOP24/26,.36	TSOP2, TSOP24/26,.36	SOJ, SOJ24/26,.34	SOJ, SOJ24/26,.34	SOJ, SOJ24/26,.34	SOJ, SOJ24/26,.34	TSOP2, TSOP24/26,.36	TSOP2, TSOP24/26,.36	SOJ,	TSOP2, TSOP24/26,.36
Contacts	26	26	24	24	24	24	26	26	24	26
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant	compliant	compliant	unknown	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	50 ns	70 ns	60 ns	60 ns	70 ns	50 ns	60 ns	50 ns	50 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-J24	R-PDSO-J24	R-PDSO-J24	R-PDSO-J24	R-PDSO-G24	R-PDSO-G24	R-PDSO-J24	R-PDSO-G24
length	17.14 mm	17.14 mm	17.15 mm	17.15 mm	17.15 mm	17.15 mm	17.14 mm	17.14 mm	17.15 mm	17.14 mm
memory density	16777216 bi	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM
memory width	4	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24	24	24
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	SOJ	SOJ	SOJ	SOJ	TSOP2	TSOP2	SOJ	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	3.76 mm	3.76 mm	3.76 mm	3.76 mm	1.2 mm	1.2 mm	3.76 mm	1.2 mm
self refresh	YES	YES	YES	NO	NO	YES	NO	NO	YES	YES
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	J BEND	J BEND	J BEND	J BEND	GULL WING	GULL WING	J BEND	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-	COMMON
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	-	e0
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
Encapsulate equivalent code	TSOP24/26,.36	TSOP24/26,.36	SOJ24/26,.34	SOJ24/26,.34	SOJ24/26,.34	SOJ24/26,.34	TSOP24/26,.36	TSOP24/26,.36	-	TSOP24/26,.36
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V
refresh cycle	4096	4096	4096	4096	4096	4096	4096	4096	-	4096
Maximum standby current	0.0003 A	0.0003 A	0.0003 A	0.001 A	0.001 A	0.0003 A	0.001 A	0.001 A	-	0.0003 A
Maximum slew rate	0.11 mA	0.08 mA	0.09 mA	0.09 mA	0.08 mA	0.11 mA	0.09 mA	0.11 mA	-	0.09 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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