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HY5116404CSLT-70

Description
EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24
Categorystorage    storage   
File Size102KB,9 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY5116404CSLT-70 Overview

EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24

HY5116404CSLT-70 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeTSOP2
package instructionTSOP2, TSOP24/26,.36
Contacts26
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
access modeFAST PAGE WITH EDO
Maximum access time70 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O typeCOMMON
JESD-30 codeR-PDSO-G24
JESD-609 codee0
length17.14 mm
memory density16777216 bit
Memory IC TypeEDO DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals24
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP24/26,.36
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
self refreshYES
Maximum standby current0.0003 A
Maximum slew rate0.08 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1
HY5117404C,HY5116404C
4Mx4, Extended Data Out mode
DESCRIPTION
This family is a 16M bit dynamic RAM organized 4,194,304 x 4-bit configuration with Extended Data Out mode CMOS
DRAMs. Extended data out mode is a kind of page mode which is useful for the read operation. The circuit and process
design allow this device to achieve high performance and low power dissipation. Optional features are access time(50, 60
or 70ns) and refresh cycle(2K ref. or 4K ref.) and power consumption (Normal or Low power with self refresh). Hyundai’s
advanced circuit design and process technology allow this device to achieve high bandwidth, low power consumption and
high reliability.
FEATURES
Ÿ
Extended data out operation
Ÿ
Read-modify-write Capability
Ÿ
TTL compatible inputs and outputs
Ÿ
/CAS-before-/RAS, /RAS-only, Hidden and
Self refresh capability
Ÿ
Max. Active power dissipation
Speed
50
60
70
Ÿ
Refresh cycle
Part number
HY5117404C
HY5116404C
Refresh
2K
4K
Normal
32ms
256ms
64ms
SL-part
2K refresh
798mW
660mW
550mW
4K refresh
605mW
495mW
440mW
Ÿ
JEDEC standard pinout
Ÿ
24/26-pin Plastic SOJ (300mil)
24/26-pin Plastic TSOP-II (300mil)
Ÿ
Single power supply of 5V
±
10%
Ÿ
Early write or output enable controlled write
Ÿ
Fast access time and cycle time
Speed
50
60
70
tRAC
50ns
60ns
70ns
tCAC
13ns
15ns
18ns
tHPC
20ns
25ns
30ns
ORDERING INFORMATION
Part Name
HY5117404CJ
HY5117404CSLJ
HY5117404CT
HY5117404CSLT
HY5116404CJ
HY5116404CSLJ
HY5116404CT
HY5116404CSLT
*SL : Low power with self refresh
This document is a general product description and is subject to change without notice. Hyundai electronics does not assume any responsibility for use of
circuits described. No patent licences are implied
Hyundai Semiconductor
Rev. 10/Sep.97
Refresh
2K
2K
2K
2K
4K
4K
4K
4K
Power
Package
24/26Pin SOJ
SL-part
24/26Pin SOJ
24/26Pin TSOP-II
SL-part
24/26Pin TSOP-II
24/26Pin SOJ
SL-part
24/26Pin SOJ
24/26Pin TSOP-II
SL-part
24/26Pin TSOP-II
1

HY5116404CSLT-70 Related Products

HY5116404CSLT-70 HY5116404CSLJ-60 HY5116404CJ-60 HY5116404CJ-70 HY5116404CSLJ-50 HY5116404CT-60 HY5116404CT-50 HY5116404CJ-50 HY5116404CSLT-60 HY5116404CSLT-50
Description EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24 EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24 EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24 EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24 EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24 EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24 EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24 EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24 EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24 EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, TSOP2-26/24
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code TSOP2 SOJ SOJ SOJ SOJ TSOP2 TSOP2 SOJ TSOP2 TSOP2
package instruction TSOP2, TSOP24/26,.36 SOJ, SOJ24/26,.34 SOJ, SOJ24/26,.34 SOJ, SOJ24/26,.34 SOJ, SOJ24/26,.34 TSOP2, TSOP24/26,.36 TSOP2, TSOP24/26,.36 SOJ, TSOP2, TSOP24/26,.36 TSOP2, TSOP24/26,.36
Contacts 26 24 24 24 24 26 26 24 26 26
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant unknown compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 70 ns 60 ns 60 ns 70 ns 50 ns 60 ns 50 ns 50 ns 60 ns 50 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
JESD-30 code R-PDSO-G24 R-PDSO-J24 R-PDSO-J24 R-PDSO-J24 R-PDSO-J24 R-PDSO-G24 R-PDSO-G24 R-PDSO-J24 R-PDSO-G24 R-PDSO-G24
length 17.14 mm 17.15 mm 17.15 mm 17.15 mm 17.15 mm 17.14 mm 17.14 mm 17.15 mm 17.14 mm 17.14 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bi
Memory IC Type EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
memory width 4 4 4 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24 24 24 24
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 SOJ SOJ SOJ SOJ TSOP2 TSOP2 SOJ TSOP2 TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 3.76 mm 3.76 mm 3.76 mm 3.76 mm 1.2 mm 1.2 mm 3.76 mm 1.2 mm 1.2 mm
self refresh YES YES NO NO YES NO NO YES YES YES
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING J BEND J BEND J BEND J BEND GULL WING GULL WING J BEND GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible - incompatible incompatible
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON - COMMON COMMON
JESD-609 code e0 e0 e0 e0 e0 e0 e0 - e0 e0
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE
Encapsulate equivalent code TSOP24/26,.36 SOJ24/26,.34 SOJ24/26,.34 SOJ24/26,.34 SOJ24/26,.34 TSOP24/26,.36 TSOP24/26,.36 - TSOP24/26,.36 TSOP24/26,.36
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V - 5 V 5 V
refresh cycle 4096 4096 4096 4096 4096 4096 4096 - 4096 4096
Maximum standby current 0.0003 A 0.0003 A 0.001 A 0.001 A 0.0003 A 0.001 A 0.001 A - 0.0003 A 0.0003 A
Maximum slew rate 0.08 mA 0.09 mA 0.09 mA 0.08 mA 0.11 mA 0.09 mA 0.11 mA - 0.09 mA 0.11 mA
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
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