MB85RC16PNF-G-JNERE1 datasheet, PDF

Datasheet> All Categories > storage> storage> MB85RC16PNF-G-JNERE1

MB85RC16PNF-G-JNERE1: DescriptionMemory Circuit, 2KX8, CMOS, PDSO8, 3.90 X 5.05 MM, 1.75 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-8; Categorystorage storage; File Size1MB，36 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

Download Datasheet Parametric Compare View All

MB85RC16PNF-G-JNERE1 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	MB85RC16PNF-G-JNERE1	-	-	View	Buy Now

MB85RC16PNF-G-JNERE1 Overview

Memory Circuit, 2KX8, CMOS, PDSO8, 3.90 X 5.05 MM, 1.75 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-8

MB85RC16PNF-G-JNERE1 Parametric

Parameter Name	Attribute value
Maker	SPANSION
Parts packaging code	SOIC
package instruction	SOP,
Contacts	8
Reach Compliance Code	unknow
JESD-30 code	R-PDSO-G8
length	5.05 mm
memory density	16384 bi
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	8
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	3.9 mm

Preview

Download Datasheet

View All

FUJITSU SEMICONDUCTOR

DATA SHEET

DS501-00001-8v0-E

Memory FRAM

16 K (2 K

8) Bit I

MB85RC16

■

DESCRIPTION

The MB85RC16 is an FRAM (Ferroelectric Random Access Memory) chip in a configuration of 2,048 words

8 bits, using the ferroelectric process and silicon gate CMOS process technologies for forming the nonvolatile

memory cells.

Unlike SRAM, the MB85RC16 is able to retain data without using a data backup battery.

The memory cells used in the MB85RC16 have at least 10

Read/Write operation endurance per byte, which

is a significant improvement over the number of read and write operations supported by other nonvolatile

memory products.

The MB85RC16 can provide writing in one byte units because the long writing time is not required unlike

Flash memory and E

PROM. Therefore, the writing completion waiting sequence like a write busy state is

not required.

■

FEATURES

: 2,048 words

8 bits

: Fully controllable by two ports: serial clock (SCL) and serial data (SDA).

: 1 MHz (Max)

: 10

times/byte

: 10 years (

°C),

95 years (

°C),

over 200 years (

°C)

: 2.7 V to 3.6 V

: Operating power supply current 70

μA

(Typ @1 MHz)

Standby current 0.1

μA

(Typ)

• Operation ambient temperature range :

−

°C

• Package

: 8-pin plastic SOP (FPT-8P-M02)

8-pin plastic SON (LCC-8P-M04)

RoHS compliant

•

Bit configuration

Two-wire serial interface

Operating frequency

Read/Write endurance

Data retention

Operating power supply voltage

Low power consumption

2013.2

MB85RC16

■

ACKNOWLEDGE (ACK)

In the I

C bus, serial data including memory address or memory information is sent and received in units of

8 bits. The acknowledge signal indicates that every 8 bits of the data is successfully sent and received. The

receiver side usually outputs the “L” level every time on the 9th SCL clock after each 8 bits are successfully

transmitted and received. On the transmitter side, the bus is temporarily released to Hi-Z every time on this

9th clock to allow the acknowledge signal to be received and checked. During this Hi-Z released period, the

receiver side pulls the SDA line down to indicate the “L” level that the previous 8 bits communication is

successfully received.

In case the slave side receives Stop condition before sending or receiving the ACK “L” level, the slave side

stops the operation and enters to the standby state. On the other hand, the slave side releases the bus state

after sending or receiving the NACK “H” level. The master side generates Stop condition or Start condition

in this released bus state.

•

Acknowledge timing overview diagram

SCL

SDA

The transmitter side should always release SDA on the 9th bit.

At this time, the receiver side outputs a pull-down if the

previous 8 bits data are received correctly (ACK response).

ACK

Start

■

MEMORY ADDRESS STRUCTURE

The MB85RC16 has the memory address buffer to store the 11-bit information for the memory address.

As for byte write, page write and random read commands, the complete 11-bit memory address is configured

by inputting the memory upper address (3 bits) and the memory lower address (8 bits), and saved to the

memory address buffer. Then access to the memory is performed.

As for a current address read command, the complete 11-bit memory address is configured and saved to

the memory address buffer, by inputting the memory upper address (3 bits) and the memory lower address(8

bits) which has saved in the memory address buffer. Then access to the memory is performed.

DS501-00001-8v0-E

MB85RC16PNF-G-JNERE1 Related Products

	MB85RC16PNF-G-JNERE1	MB85RC16PNF-G-JNE1
Description	Memory Circuit, 2KX8, CMOS, PDSO8, 3.90 X 5.05 MM, 1.75 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-8	Memory Circuit, 2KX8, CMOS, PDSO8, 3.90 X 5.05 MM, 1.75 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-8
Maker	SPANSION	SPANSION
Parts packaging code	SOIC	SOIC
package instruction	SOP,	SOP,
Contacts	8	8
Reach Compliance Code	unknow	unknow
JESD-30 code	R-PDSO-G8	R-PDSO-G8
length	5.05 mm	5.05 mm
memory density	16384 bi	16384 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8
Number of functions	1	1
Number of terminals	8	8
word count	2048 words	2048 words
character code	2000	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	2KX8	2KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	1.75 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
width	3.9 mm	3.9 mm

Recommended Resources

High voltage alarm circuit

Frequency servo circuit block diagram

Lathe no-load automatic shutdown power-saving circuit_1

LM3578A used as a buck regulator circuit diagram

CMOS interface circuit composed of photoelectric isolator

Gain programmer amplifier circuit

Screen flickering and water ripple problem: I bought a 2440 development board. It comes with a NEC screen. But the screen datasheet doesn't have any information on how to adjust the screen. I called technical support and they said there's somet...; ge11232002 Embedded System

[SAMR21 New Gameplay] 16. Switching between Graphical Programming and Code Programming: We have previously introduced the graphical programming method using MakeCode. By using the graphical method, you can easily and quickly write programs. Through extensions (libraries), it is also very...; dcexpert MicroPython Open Source section

[Mil MYC-JX8MPQ Review] + Unboxing and Screen Review: Thanks to Mir for giving me the opportunity to review this product again. Let’s start with the unboxing review.The packaging of this board is similar to that of the previous MP151 board, and comes wit...; 流行科技 Special Edition for Assessment Centres

Quick answer: How to use PWM to generate a sinusoidal signal in 51?: How to use pwm to generate sinusoidal signal in 51?...; 捷芬哥 Embedded System

80 yuan LQFP48 package four-axis SPI motion control chip manual: SPI communication, only 10 instructions are needed to complete complex tasks.Single module with four-axis output, multiple modules with multiple slaves can work up to 120 axes.Supports four-axis, thre...; w75815895 Industrial Control Electronics

iar embedded assembly problem: The inline assembly program of gcc is very different from the inline assembly language of iar. How can I modify it from the syntax of gcc to the syntax of iar? iar is for msp430. In gcc, __asm volatil...; 260658 Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components