S29CL032J0RQAI103 datasheet, PDF

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S29CL032J0RQAI103: DescriptionFlash, 1MX32, 48ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80; Categorystorage storage; File Size2MB，76 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29CL032J0RQAI103 Overview

Flash, 1MX32, 48ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80

S29CL032J0RQAI103 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	QFP
package instruction	QFP,
Contacts	80
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	48 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
startup block	TOP
JESD-30 code	R-PQFP-G80
JESD-609 code	e0
length	20 mm
memory density	33554432 bi
Memory IC Type	FLASH
memory width	32
Humidity sensitivity level	3
Number of functions	1
Number of terminals	80
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX32
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Programming voltage	3.3 V
Certification status	Not Qualified
Maximum seat height	3.35 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
type	NOR TYPE
width	14 mm

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S29CD-J & S29CL-J Flash Family

S29CD032J, S29CD016J, S29CL032J, S29CL016J

32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only

Simultaneous Read/Write, Dual Boot, Burst Mode

Flash Memory with VersatileI/O™

S29CD-J & S29CL-J Flash Family Cover Sheet

Data Sheet

(Preliminary)

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. The Preliminary status of this document indicates that product qualification has

been completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.

Publication Number

S29CD-J_CL-J_00

Revision

Amendment

Issue Date

September 27, 2006

Data

Sheet

(Pre limin ar y)

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29CD-J & S29CL-J Flash Family

S29CD-J_CL-J_00_B1 September 27, 2006

Data

Sheet

(Pre limin ar y)

Table of Contents

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Distinctive Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Performance Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table of Contents

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figures

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Tables

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1

Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Input/Output Descriptions and Logic Symbols

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Block Diagram of Simultaneous Read/Write Circuit

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Physical Dimensions/Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.1

80-Pin PQFP Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2

PRQ080–80-Lead Plastic Quad Flat Package Physical Dimensions . . . . . . . . . . . . . . . . . . 10

5.3

80-Ball Fortified BGA Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.4

Special Package Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.5

LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm) Physical Dimensions. . . . . . . . . . . . 12

Additional Resources.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1

Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2

Specification Bulletins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.3

Hardware and Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4

Contacting Spansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Product Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.1

Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Device Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.1

Device Operation Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.2

Asynchronous Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.3

Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.4

Synchronous (Burst) Read Mode & Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . .

8.5

Autoselect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.6

VersatileI/O™ (V

) Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.7

Program/Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.8

Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.9

Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Advanced Sector Protection/Unprotection

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1

Advanced Sector Protection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.2

Persistent Protection Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.3

Persistent Protection Bit Lock Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.4

Dynamic Protection Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.5

Password Protection Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.6

Hardware Data Protection Methods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.

Secured Silicon Sector Flash Memory Region

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

10.1 Secured Silicon Sector Protection Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

10.2 Secured Silicon Sector Entry and Exit Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Electronic Marking

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Power Conservation Modes

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.1 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.2 Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.3 Hardware RESET# Input Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.4 Output Disable (OE#). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.

12.

S29CD-J & S29CL-J Flash Family

S29CD-J_CL-J_00_B1 September 27, 2006

Da ta

Shee t

(Prelimi nar y)

13.

14.

15.

16.

17.

18.

Electrical Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

13.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Operating Ranges

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

DC Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

15.1 Zero Power Flash. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Test Conditions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Test Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

17.1 Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

AC Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.1 V

and V

Power-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.2 Asynchronous Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.3 Synchronous Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.4 Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.5 Write Protect (WP#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.6 Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.7 Alternate CE# Controlled Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.8 Erase and Programming Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.9 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18.10 PQFP and Fortified BGA Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

19.

20.

21.

Appendix 1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

19.1 Common Flash Memory Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Appendix 2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

20.1 Command Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Revision History

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Figures

Figure 8.1

Figure 8.2

Figure 8.3

Figure 8.4

Figure 8.5

Figure 8.6

Figure 8.7

Figure 8.8

Figure 9.1

Figure 9.2

Figure 9.3

Figure 13.1

Figure 13.2

Figure 15.1

Figure 15.2

Figure 16.1

Figure 17.1

Figure 18.1

Figure 18.2

Figure 18.3

Figure 18.4

Figure 18.5

Figure 18.6

Figure 18.7

Figure 18.8

Asynchronous Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Synchronous/Asynchronous State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

End of Burst Indicator (IND/WAIT#) Timing for Linear 8-Word Burst Operation . . . . . . . . . . 23

Initial Burst Delay Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Data# Polling Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Toggle Bit Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Advanced Sector Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

PBB Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

PPB Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Maximum Negative Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Maximum Positive Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

CC1

Current vs. Time (Showing Active and Automatic Sleep Currents) . . . . . . . . . . . . . . . . 49

Typical I

CC1

vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Input Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

and V

Power-up Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Conventional Read Operations Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Asynchronous Command Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Burst Mode Read (x32 Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Synchronous Command Write/Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

RESET# Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

WP# Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Program Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

S29CD-J & S29CL-J Flash Family

September 27, 2006 S29CD-J_CL-J_00_B1

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The Four Levels of Analog Chip Design - Experience (Reposted): I have been studying analog chip design for microelectronics at Fudan University for a master's degree and now have five years of work experience. It has been eight years, and I have listened to the a...; settleinsh Analog electronics

Group outing?: Are there any group activities among the eeworld administrators today? It feels a bit deserted......; Melinda123 Talking

Recommendations for pad and steel mesh design of asymmetric packaged power chips: Power management chips are widely used in board-level power systems, including controllers and power MOSFETs. However, for high-current power management chips, based on the technical characteristics o...; qwqwqw2088 Power technology

How to achieve 20m ultrasonic distance measurement: I have done ultrasonic ranging before, but the range was about 5m. Now I want to reach 20m. I have seen products from SensComp, but the cost is too high, and all the components are imported. Some peop...; 672192076 Embedded System

LM3S8962 Study Notes 3——SD Card Read and Write Routine Analysis: After looking at the routines and related materials provided by lm3s8962, I feel that a transplanted FatFs module is used to implement the reading and writing functions of the SD card. The routine mat...; drjloveyou Microcontroller MCU

Meixin Award Live Broadcast: Supporting Integrated Digital IO Technology for Industrial Systems Registration Open: Meixin Award Live Broadcast: Supporting Integrated Digital IO Technology for Industrial Systems Registration OpenClick here to registerLive broadcast time: 10:00-11:30 am, June 3, 2021Live broadcast t...; EEWORLD社区 Industrial Control Electronics

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