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S71WS512PD0HH3YV0

Description
Flash, 32MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84
Categorystorage    storage   
File Size308KB,11 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

S71WS512PD0HH3YV0 Overview

Flash, 32MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84

S71WS512PD0HH3YV0 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA, BGA84,10X12,32
Contacts84
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time80 ns
JESD-30 codeR-PBGA-B84
length11.6 mm
memory density536870912 bi
Memory IC TypeFLASH
memory width16
Mixed memory typesFLASH+PSRAM
Number of functions1
Number of terminals84
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA84,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
S71WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode
Flash Memory with CellularRAM
Data Sheet
S71WS-P based MCP Products Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-P_00
Revision
A
Amendment
16
Issue Date
November 11, 2010
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