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SMDP-672061HV-30SB

Description
FIFO, 16KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, DFP-28
Categorystorage    storage   
File Size607KB,20 Pages
ManufacturerAtmel (Microchip)
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SMDP-672061HV-30SB Overview

FIFO, 16KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, DFP-28

SMDP-672061HV-30SB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeDFP
package instructionDFP, FL28,.4
Contacts28
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time30 ns
period time40 ns
JESD-30 codeR-XDFP-F28
JESD-609 codee0
memory density147456 bi
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals28
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX9
ExportableNO
Package body materialUNSPECIFIED
encapsulated codeDFP
Encapsulate equivalent codeFL28,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.3 mm
Maximum standby current0.005 A
Maximum slew rate0.11 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Features
First-in First-out Dual Port Memory
16384 bits x 9 Organization
Fast Flag and Access Times: 15, 30 ns
Wide Temperature Range: -55°C to +125°C
Programmable Half Full Flag
Fully Expandable by Word Width or Depth
Asynchronous Read/Write Operations
Empty, Full and Half Flags in Single Device Mode
Retransmit Capability
Bi-directional Applications
Battery Back-up Operation: 2V Data Retention
TTL Compatible
Single 5V + 10% Power Supply
No Single Event Latch Up Below an LET threshold of 80 MeV/mg/cm
2
Tested up to a Total Dose of 30 Krads (accorcing to MIL-STD-883 TM1019)
QML Q and V with SMD 5962-93177
ESSC B with Specification 9301/48
Description
The M672061H implements a first-in first-out algorithm, featuring asynchronous
read/write operations. The FULL and EMPTY flags prevent data overflow and under-
flow. The Expansion logic allows unlimited expansion in word size and depth with no
timing penalties. Twin address pointers automatically generate internal read and write
addresses, and no external address information are required for the Atmel FIFOs.
Address pointers are automatically incremented with the write pin and read pin. The 9
bits wide data are used in data communications applications where a parity bit for
error checking is necessary. The Retransmit pin resets the Read pointer to zero with-
out affecting the write pointer. This is very useful for retransmitting data when an error
is detected in the system.
Using an array of eight transistors (8T) memory cell, the M672061H combines an
extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns
over the full temperature range. All versions offer battery backup data retention capa-
bility with a typical power consumption at less than 2 µW.
For military/space applications that demand superior levels of performance and reli-
ability the M672061H is processed according to the methods of the latest revision of
the MIL PRF 38535 (Q and V) or ESA SCC 9000.
Rad. Tolerant
High Speed
16 Kb x 9
Parallel FIFO with
Programmable
Flag
M672061H
4144I–AERO–05/04
1

SMDP-672061HV-30SB Related Products

SMDP-672061HV-30SB SMCP-672061HV-15SB SMDP-672061HV-15SB MMDP-672061HV-15 SMCP-672061HV-30SB MMCP-672061HV-15 MMDP-672061HV-30 MMCP-672061HV-30
Description FIFO, 16KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, DFP-28 FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 FIFO, 16KX9, 15ns, Asynchronous, CMOS, 0.400 INCH, DFP-28 FIFO, 16KX9, 15ns, Asynchronous, CMOS, 0.400 INCH, DFP-28 FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 FIFO, 16KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, DFP-28 FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DFP DIP DFP DFP DIP DIP DFP DIP
package instruction DFP, FL28,.4 DIP, DIP28,.3 DFP, FL28,.4 DFP, FL28,.4 DIP, DIP28,.3 DIP, DIP28,.3 DFP, FL28,.4 DIP, DIP28,.3
Contacts 28 28 28 28 28 28 28 28
Reach Compliance Code compli compliant compliant compliant compliant compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 30 ns 15 ns 15 ns 15 ns 30 ns 15 ns 30 ns 30 ns
period time 40 ns 25 ns 25 ns 25 ns 40 ns 25 ns 40 ns 40 ns
JESD-30 code R-XDFP-F28 R-CDIP-T28 R-XDFP-F28 R-XDFP-F28 R-CDIP-T28 R-CDIP-T28 R-XDFP-F28 R-CDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
memory density 147456 bi 147456 bit 147456 bit 147456 bit 147456 bit 147456 bi 147456 bi 147456 bi
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 16KX9 16KX9 16KX9 16KX9 16KX9 16KX9 16KX9 16KX9
Exportable NO NO NO NO NO NO NO NO
Package body material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
encapsulated code DFP DIP DFP DFP DIP DIP DFP DIP
Encapsulate equivalent code FL28,.4 DIP28,.3 FL28,.4 FL28,.4 DIP28,.3 DIP28,.3 FL28,.4 DIP28,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.3 mm 3.94 mm 3.3 mm 3.3 mm 3.94 mm 3.94 mm 3.3 mm 3.94 mm
Maximum standby current 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
Maximum slew rate 0.11 mA 0.12 mA 0.12 mA 0.12 mA 0.11 mA 0.12 mA 0.11 mA 0.11 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE FLAT FLAT THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 7.62 mm 10.16 mm 10.16 mm 7.62 mm 7.62 mm 10.16 mm 7.62 mm
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)

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