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5962-01-299-3045

Description
IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC
Categorystorage    storage   
File Size297KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric

5962-01-299-3045 Overview

IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC

5962-01-299-3045 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP16,.3
Reach Compliance Code_compli
Maximum access time40 ns
JESD-30 codeR-XDIP-T16
Memory IC TypeOTP ROM
memory width8
Number of terminals16
word count32 words
character code32
Maximum operating temperature70 °C
Minimum operating temperature
organize32X8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.11 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
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