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DSOT23-03-3011-3011FJ

Description
Array/Network Resistor, Divider, 0.25W, 100V, 1% +/-Tol, 25ppm/Cel, Surface Mount, 0204, CHIP
CategoryPassive components    The resistor   
File Size314KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

DSOT23-03-3011-3011FJ Overview

Array/Network Resistor, Divider, 0.25W, 100V, 1% +/-Tol, 25ppm/Cel, Surface Mount, 0204, CHIP

DSOT23-03-3011-3011FJ Parametric

Parameter NameAttribute value
MakerTT Electronics plc
package instructionCHIP
Reach Compliance Codecompli
ECCN codeEAR99
Component power consumption0.125 W
The first element resistor3010 Ω
Manufacturer's serial numberDSOT
Installation featuresSURFACE MOUNT
Network TypeDIVIDER
Number of components2
Number of functions1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
Second/last element resistor3010 Ω
size code0204
surface mountYES
Temperature Coefficient25 ppm/°C
Temperature coefficient tracking2 ppm/°C
Terminal shapeONE SURFACE
Tolerance1%
Operating Voltage100 V
Wire Bondable Voltage
Divider Network
DSOT Series
Tight TCR tracking
Extremely small footprint
Precision ratio tolerances to ±0.05%
Ultra-stable tantalum nitride resistors
IRC’s TaNSil
®
voltage divider networks are ideally suited for low cost
divider applications that demand precision performance in a wire
bondable package.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and minia-
ture physical dimensions. Excellent performance in harsh, humid environments is a trademark of IRC’s self-
passivating TaNSil
®
resistor film.
For applications requiring high performance voltage dividers in a miniature, wire bondable package, specify
IRC DSOT wire bondable die.
Electrical Data
Resistance Range Each Resistor
Resistance Range Each Package
Absolute Tolerance
Ratio Tolerance to R1
Absolute TCR
Tracking TCR
Element Power Rating
Package Power Rating
Rated Operating Voltage
(not to exceed
P x R)
Operating Temperature
Noise
Substrate Material
Substrate Thickness
Bond Pad
Metallization
Backside
Passivation
General Note
TCR/Inspection Code Table
10Ω to 500KΩ
to 1.0MΩ
to ±0.1%
to ±0.05%
to ±25ppm/°C
to ±5ppm/°C
125mW @70°C
250mW @ 70°C
100V
-55°C to + 150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
minimum)
0.0095˝ ±0.001
(0.241mm ±0.025)
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
00
01
02
03
Absolute TCR
Commercial
Code
MIL
Inspection
Code*
04
05
06
07
*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection
Power Derating Data
Aluminum
Gold
10KÅ minimum
15KÅ minimum
Silicon
(gold available)
Silicon Dioxide or
Silicon Nitride
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
DSOT Series Issue January 2009 Sheet 1 of 3
Recruiting electronic engineers (FPGA engineers)
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