Low Value Flat
Chip Resistor
LRC/LRF Series
Welwyn Components
•
•
•
•
•
Standard 2512, 2010 and 1206 sizes
Resistance values down to 0.003 ohms
Leach resistant solder-plated copper
wrap-around termination
Low inductance - less than 0.2nH
AEC-Q200 Qualified
Electrical Data
LR1206
Power rating at 70°C
Resistance range
Dielectric withstanding voltage
TCR
Resistance tolerance
Temperature rise at rated power
Pad and trace area for max power rating @ 70°C
2
LR2010
1.0
0R003 to 1R
200
≤R005
5%, >R005 1, 2, 5%
LR2512
1.5/2.0*
0R003 to 1R
200
watts
ohms
volts
ppm/°C
%
°C
mm
2
0.5
0R010 to 1R
200
±100 (Contact factory for value below 0.050 ohms)
40
30
80
30
90
100
*2 Watts with total solder pad and trace size of 300 mm
Physical Data
Dimensions (mm)
Size
LR1206
LR2010
LR2512
L
3.20±0.305
5.23±0.38
6.50±0.38
W
1.63±0.203
2.64±0.25
3.25±0.25
H (max)
0.8
0.8
0.8
D
0.48±0.25
0.48±0.25
0.48±0.25
D1
0.48±0.25
0.48±0.25
0.48±0.25
LR 1206 / 2010 / 2512
W
H
D
Protective Overcoat
Resistive Element
Copper Termination
L
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
04.10
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
23
Low Value Flat
Chip Resistor
LRC/LRF Series
Welwyn Components
Dimensions (mm)
A
LR1206
LR2010
LR2512
2.0
3.05
3.7
B
4.0
6.5
7.75
C
1.25
B
A
1.5
C
1.5
4
6
7
14
16
18
21
22
Temperature Cycling
JESD22 Method JA-104
R% 0.25 0.1
R% 0.5
R% 0.5
R%
1
0.2
0.2
0.5
Power Rating
ref
3
AEC-Q200 Table 7
Method
Test
High Temp. Exposure MIL-STD-202 Method 108
Moisture Resistance MIL-STD-202 Method 106
Biased Humidity MIL-STD-202 Method 103
Vibration MIL-STD-202 Method 204
Thermal Shock MIL-STD-202 Method 107
Solderability
Board Flex
Terminal Strength
Short Term Overload
Low Temperature Storage
Leach Resistance
J-STD-002
AEC-Q200-005
AEC-Q200-006
6.25 x Pr for 2s
-65°C for 100 hours
Solder dip at 250°C
(add R05)
Max.
(@1R0)
Typ.
0.2
(%)
100
80
60
40
20
0
25
70
Ambient temperature
150 (°C)
R% 0.5
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
15 Resistance to Soldering Heat MIL-STD-202 Method 210
R% 0.5 0.05
R% 0.25 0.05
R% 0.25 0.1
>95% coverage
R% 0.5
R% 0.5
R% 0.5
90s minimum
0.2
R% 0.25 0.1
LRC 25
12 1 w
2
att
LRC 20
10 0.5
1 watt
watt
LRC 12
06 0.25
.5 wa
a
w
tt
tt
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values
≥
R01.
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
LRF2512
–
R01GW
Type
Mounting
F
Conventional (element up)
Flip-chip (element down)
Values > R025
Values < R025
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
G
J
1%
2%
5%
1206 or 2010
2512
All sizes
3000/reel
1800/reel
1000/reel
Packing
W
T1
Tape
Standard
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
04.10
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