EEWORLDEEWORLDEEWORLD

Part Number

Search

PPC1253520DLFBLK

Description
RESISTOR, METAL GLAZE/THICK FILM, 1W, 0.5%, 25ppm, 352ohm, SURFACE MOUNT, 2508, MELF, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size178KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

PPC1253520DLFBLK Overview

RESISTOR, METAL GLAZE/THICK FILM, 1W, 0.5%, 25ppm, 352ohm, SURFACE MOUNT, 2508, MELF, ROHS COMPLIANT

PPC1253520DLFBLK Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTT Electronics plc
package instructionMELF, ROHS COMPLIANT
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresPRECISION
Manufacturer's serial numberPPC
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeCYLINDRICAL PACKAGE
method of packingBULK
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance352 Ω
Resistor typeFIXED RESISTOR
size code2508
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient25 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage350 V
Metal Glaze
Surface Mount
Precision Power Chip
PPC Series
Surge tolerant
Up to 1000 volts
Tight TCR - 25 ppm/°C
Tolerance down to ±0.1%
Solder over nickel
barrier
High
temperature
dielectric
coating
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Electrical Data
Size
Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
IRC
Type
PPC1/8
PPC1/2
PPC1
PPC2
Power
Rating at
70°C (W)
1/8 W
1/2 W
1W
2W 1.33W
Working
Voltage
200
300
350
500
Resistance
Range
(ohms)
100 - 10K
100 - 10K
100 - 10K
100 - 10K
0.1% (B)
0.25% (C)
0.5% (D)
Tolerance
(±%)
Qty /
Reel (7")
2500
1500
N/A
N/A
Qty /
Reel (13")
10000
5000
5000
1500
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5 2.5 x
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C
for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Chip mounted in center of 90mm long board, deflected 1mm
so as to exert pull on chip contacts for 5 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
PPC Series Issue November 2008 Sheet 1 of 3
Characteristics and Applications of Diodes
Characteristics and Applications of Diodes Semiconductor diodes are used in almost all electronic circuits. They play an important role in many circuits. They are one of the earliest semiconductor dev...
zdr Industrial Control Electronics
Overview of PLC Technology Structure
PLC uses different processing technologies to build internal memory. Almost all popular PLDs are unipolar CMOS-PROCESS, and there are very few that use bipolar FUSE technology. PLDs based on CMOS-PROC...
eeleader FPGA/CPLD
Analysis of SysCtlDelay() Function
I have been using the SysCtlDelay() function a lot recently. I think it is a good function that can achieve accurate delay. Not long ago, when I was working on the NRF905 module, there was a point tha...
myredback Microcontroller MCU
The main purpose of immersion gold circuit board and the difference from other processes
There is a very common process in the surface treatment of circuit boards, which is called immersion gold process. In production, the cost of immersion gold board is relatively high, and immersion gol...
中信华 PCB Design
TAxIV interrupts for msp430
In the following program, since it is in continuous counting mode, the counter will count repeatedly from 0 to FFFF, but the value of TA0CCRn is not set, so the TAIFG interrupt is only generated at 0F...
fish001 Microcontroller MCU
Have you heard about the misunderstandings about infrared night vision?
The development direction of video surveillance is outdoor, the development direction of outdoor surveillance is night vision, and the development direction of night vision is infrared. This trend is ...
fish001 Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1963  2237  52  1836  145  40  46  2  37  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号