EEWORLDEEWORLDEEWORLD

Part Number

Search

R0202AS-02-1210-C

Description
Fixed Resistor, Thin Film, 0.25W, 121ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

R0202AS-02-1210-C Overview

Fixed Resistor, Thin Film, 0.25W, 121ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

R0202AS-02-1210-C Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTT Electronics plc
package instruction, 0202
Reach Compliance Codecompli
ECCN codeEAR99
JESD-609 codee3
Manufacturer's serial numberWBC
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance121 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeONE SURFACE
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
MSP430 inside---Amazon Fire TV
[b][/b]The one in the red frame is MSP430F5435A, which should be a very powerful model among MSP430.“[color=#666666][font=Raleway, Arial, sans-serif][size=16px]This post is a part of the series [/size...
wstt Microcontroller MCU
Embedding assembly in C
In C51 programming, sometimes when controlling some devices, strong real-time performance is required. At this time, it is necessary to embed ASM statements in them. There are many ways to embed them,...
老夫子 MCU
Apple is jointly developing Micro LED technology with TSMC
[b]Apple is jointly developing Micro LED technology with TSMC[/b] Although Apple has just launched its first iPhone with an OLED screen, it is well known that Apple has been investing heavily in Micro...
zhang2017yi Analogue and Mixed Signal
Why isn’t the FPGA sector very popular?
Why isn't the FPGA section popular? The replies to the forum are few and far between, and I haven't seen any good posts with hundreds or thousands of replies. The total number of posts is also quite l...
wu12345 FPGA/CPLD
The big question of small resistors, is Rb really necessary? (Repost)
Would you add a resistor to match the input DC resistance of your op amp circuit? Many of us would dogmatically think that adding Rb is a "good idea" (see the circuit in Figure 1 below) and making its...
qwqwqw2088 Analogue and Mixed Signal
The domestic Gaoyun FPGA GWIN-4B development board cannot use the MSPI pin. Please help
Because I want to operate external FLASH, after the program is synthesized, the layout and routing prompts cannot be used? As shown in the picture, any big guy can give me some advice, I will be grate...
怀揣少年梦 Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1588  2004  709  1684  2538  32  41  15  34  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号