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BCR27002KCGHWS

Description
Fixed Resistor, Thin Film, 0.25W, 270000ohm, 75V, 10% +/-Tol, -50,50ppm/Cel, 0202,
CategoryPassive components    The resistor   
File Size82KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

BCR27002KCGHWS Overview

Fixed Resistor, Thin Film, 0.25W, 270000ohm, 75V, 10% +/-Tol, -50,50ppm/Cel, 0202,

BCR27002KCGHWS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Reach Compliance Codeunknow
structureChi
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.253 mm
Package length0.5 mm
Package formSMT
Package width0.5 mm
method of packingWaffle Pack
Rated power dissipation(P)0.25 W
resistance270000 Ω
Resistor typeFIXED RESISTOR
seriesBCR
size code0202
technologyTHIN FILM
Temperature Coefficient-50,50 ppm/°C
Tolerance10%
Operating Voltage75 V
BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
CHIP
RESISTORS
FEATURES
Wire bondable
Product may not
be to scale
Only one wire bond required
Small size: 0.020 inches square
Resistance range: 10
Ω
to 1 MΩ
Oxidized silicon substrate for good power dissipation
Resistor material: Tantalum nitride, self-passivating
Moisture resistant
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
to 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 1.0 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
75 V max.
250 mW
± 0.25 % max.
ΔR/R
www.vishay.com
54
For technical questions, contact:
efi@vishay.com
Document Number: 61023
Revision: 23-Jul-09
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